Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT29F16G08ABACAWP-IT:C
Micron Technology
Micron Technology's MT29F16G08ABACAWP-IT:C is a 3.3V SLC NAND Flash Memory with 2GX8 organization, operating from -40 to 85°C. It features a 4K page size, parallel interface, and industrial temperature grade. Ideal for applications requiring fast access times and high memory density in compact designs.
30 ns
YES
NO
R-PDSO-G48
e3
18.4 mm
17179869184 bit
FLASH
8
1
4K
48
2147483648 words
2G
ASYNCHRONOUS
85 Cel
-40 Cel
2GX8
PLASTIC/EPOXY
TSOP1
TSSOP48,.8,20
RECTANGULAR
SMALL OUTLINE, THIN PROFILE
PARALLEL
260
3/3.3
2.7
Not Qualified
1.2 mm
512K
.00005 Amp
Flash Memories
50 mA
3.6 V
2.7 V
3.3
CMOS
INDUSTRIAL
Matte Tin (Sn)
GULL WING
.5 mm
DUAL
30
SLC NAND TYPE
12 mm
N25Q128A13E1440E
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
108 MHz
R-PBGA-B24
8 mm
134217728 bit
24
134217728 words
128M
SYNCHRONOUS
128MX1
TBGA
GRID ARRAY, THIN PROFILE
SERIAL
NOT SPECIFIED
3
BALL
1 mm
BOTTOM
6 mm
W25Q128FVPIF
Winbond Electronics
W25Q128FVPIF by Winbond Electronics is a 16MX8 NOR type flash memory with 134217728 bit memory density. It operates at up to 104 MHz clock frequency, has a supply voltage range of 2.7V to 3.6V, and supports industrial temperature grade applications. This small outline package with dual terminals is ideal for synchronous operations in various electronic devices requiring reliable non-volatile memory storage.
104 MHz
R-PDSO-N8
16777216 words
16M
16MX8
HVSON
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
.8 mm
NO LEAD
1.27 mm
NOR TYPE
5 mm
MT29F128G08CEAAAC5:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: VFLGA; Package Shape: RECTANGULAR; Programming Voltage (V): 2.7;
R-PBGA-B52
18 mm
137438953472 bit
52
17179869184 words
16G
70 Cel
0 Cel
16GX8
VFLGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
COMMERCIAL
BUTT
MLC NAND TYPE
14 mm
MT29F128G08CECABH1-10Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B100;
R-PBGA-B100
e1
100
VBGA
GRID ARRAY, VERY THIN PROFILE
TIN SILVER COPPER
MT29F128G08CECABH1-12:A
Tin/Silver/Copper (Sn/Ag/Cu)
MT29F128G08CECABH1-12ITZ:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; Type: MLC NAND TYPE;
MT29F128G08CECABH1-12Z:A
Micron Technology's MT29F128G08CECABH1-12Z:A is a 16GX8 MLC NAND flash memory with 137.4Gb density and operates at 3.3V. It features synchronous operation, very thin profile grid array package, and commercial temperature grade suitability for various applications requiring high-density storage in compact devices.
MT29F128G08CFAAAWP:A
Micron Technology's MT29F128G08CFAAAWP:A is a 3.3V MLC NAND Flash Memory with 16GX8 organization, operating in asynchronous mode. It features a memory density of 137.4Gb and is suitable for commercial applications requiring high-speed parallel data processing at temperatures ranging from 0 to 70°C.
MT29F128G08CFAAAWPIT:A
Micron Technology's MT29F128G08CFAAAWPIT:A is a 16GX8 MLC NAND flash memory with 137.4Gb density, operating at 3.3V and -40 to 85°C. It features a small outline package, parallel interface, and industrial temperature grade suitable for various embedded applications.
MT29F128G08CFAAAWPITZ:A
Micron Technology's MT29F128G08CFAAAWPITZ:A is a 16GX8 MLC NAND Flash Memory with 137.4Gb density, operating at 3.3V and -40 to 85°C. It features a small outline package, parallel interface, and is ideal for industrial applications requiring high memory capacity in compact designs.
MATTE TIN
MT29F128G08CFAAAWPZ:A
Micron Technology's MT29F128G08CFAAAWPZ:A is a 16GX8 MLC NAND flash memory with 17179869184 words capacity. Operating at 3.3V, it offers 137438953472 bits density and supports parallel programming. Ideal for commercial applications requiring high-speed data storage in compact devices.
MT29F128G08CFAABWP-12:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Functions: 1;
MT29F128G08CFAABWP-12Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Words Code: 16G;
MT29F256G08CJAAAWP:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Memory Width: 8;
274877906944 bit
34359738368 words
32G
32GX8
MT29F256G08CJAAAWPIT:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Functions: 1;
MT29F256G08CJAAAWPITZ:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MT29F256G08CJAAAWPZ:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Memory Density: 274877906944 bit;
MT29F256G08CJAABWP-12:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Width: 12 mm;
MT29F256G08CJAABWP-12Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
MT29F256G08CKCABH2-10Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: TBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
MT29F256G08CKCABH2-12:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;
MT29F256G08CKCABH2-12Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
MT29F256G08CMAAAC5:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: VFLGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
MT29F256G08CMCABH2-10Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words Code: 32G;
MT29F256G08CMCABH2-12:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: TBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
MT29F256G08CMCABH2-12ITZ:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
MT29F512G08CUAAAC5:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: VFLGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
549755813888 bit
68719476736 words
64G
64GX8
MT29F512G08CUCABH3-10:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;
LBGA
GRID ARRAY, LOW PROFILE
1.4 mm
MT29F512G08CUCABH3-10ITZ:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
MT29F512G08CUCABH3-10Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
MT29F512G08CUCABH3-12:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
MT29F512G08CUCABH3-12ITZ:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B100;
MT29F64G08CBAAAWP:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Memory Density: 68719476736 bit;
68719476736 bit
8589934592 words
8G
8GX8
MT29F64G08CBAAAWPIT:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
MT29F64G08CBAAAWPZ:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
MT29F64G08CBAABWP-12Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Words: 8589934592 words;
MT29F64G08CBCABH1-10Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
MT29F64G08CBCABH1-12:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; No. of Words: 8589934592 words;
MT29F64G08CBCABH1-12ITZ:A
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; Technology: CMOS;
MT29F64G08CBCABH1-12Z:A
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; Organization: 8GX8;
MT29F128G08AUABAC5:B
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: VFLGA; Package Shape: RECTANGULAR; Length: 18 mm;
MT29F128G08AUABAC5-IT:B
FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: VFLGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
MT29F128G08AUCBBH3-12:B
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, LOW PROFILE;
MT29F128G08AUCBBH3-12IT:B
MT29F128G08AUCBBH3-12IT:B by Micron Technology is a 16GX8 MLC NAND flash memory with 137.4Gb density, operating at 3.3V. It features synchronous mode, industrial temperature grade, and parallel interface. Ideal for applications requiring high-speed data storage in compact devices.
MT29F16G08ABABAWP:B
MT29F16G08ABABAWP:B by Micron Technology is a 3.3V SLC NAND Flash Memory with 2GX8 organization, 4K page size, and 512K sector size. It operates in commercial temperature grade with parallel interface. Ideal for applications requiring fast access times and low standby current.
20 ns
MT29F16G08ABABAWP-IT:B
Micron Technology's MT29F16G08ABABAWP-IT:B is a 3.3V SLC NAND Flash Memory with 2GX8 organization, operating from -40 to 85°C. It has a page size of 4K words and sector size of 512K words, suitable for industrial applications requiring fast access times and low standby current.
MT29F16G08ABCBBH1-12:B
FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 50 mA;
BGA100,10X17,40
1.8,3/3.3
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