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W25Q128FVPIF

Winbond Electronics

W25Q128FVPIF by Winbond Electronics

W25Q128FVPIF by Winbond Electronics is a 16MX8 NOR type flash memory with 134217728 bit memory density. It operates at up to 104 MHz clock frequency, has a supply voltage range of 2.7V to 3.6V, and supports industrial temperature grade applications. This small outline package with dual terminals is ideal for synchronous operations in various electronic devices requiring reliable non-volatile memory storage.

Median Price

$1.335

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.335

100+ parts

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1k+ parts

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100

$1.335

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Vyrian

USA . 4,735 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,735

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 352 parts In-Stock

1+ parts

$12.269

100+ parts

-

1k+ parts

-

10k+ parts

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352

$12.269

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QUARKTWIN TECHNOLOGY LTD

USA . 3,868 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,868

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.309

1k+ parts

$1.269

10k+ parts

$1.242

100

-

$1.309

$1.269

$1.242

Overview

Elevate your electronics with the W25Q128FVPIF by Winbond Electronics, a top-notch flash memory device that guarantees reliability and performance. Winbond Electronics is renowned for producing high-quality components, and this product is no exception. Perfect for a wide range of applications, this flash memory offers customers unmatched value and benefits. Say goodbye to slow data transfer speeds and hello to seamless performance with the W25Q128FVPIF. Trust Winbond Electronics to provide you with cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components of the flash memory, making it suitable for various operating conditions.

Surface Mount: YES

The surface mount feature allows for easy integration onto circuit boards, saving space and enabling efficient electrical connections.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and coordination between data transfers, leading to reliable performance and data integrity.

Nominal Supply Voltage (Vsup): 3V

The nominal supply voltage of 3V ensures compatibility with standard power sources and efficient power consumption, making the flash memory cost-effective.

Organization: 16MX8

The organization of 16MX8 allows for high memory density and efficient storage of data, making it suitable for applications that require large capacity.

Maximum Clock Frequency (fCLK): 104MHz

The high maximum clock frequency of 104MHz enables fast data transfer rates and processing speeds, making the flash memory ideal for high-performance applications.

Memory IC Type: FLASH

The use of flash memory technology provides non-volatile storage capabilities, allowing data to be retained even when the power is turned off, making it reliable for storing critical information.

Technical Specifications

Flash Memory W25Q128FVPIF attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5 mm

Trade Compliance

W25Q128FVPIF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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