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SST39VF402C-70-4I-B3KE

Microchip Technology

SST39VF402C-70-4I-B3KE by Microchip Technology

SST39VF402C-70-4I-B3KE by Microchip Technology is a 256Kx16 NOR flash memory with 3V nominal voltage. It features 100,000 write/erase cycles, operates in industrial temperature range (-40 to 85°C), and has a max access time of 70ns. Ideal for applications requiring fast, reliable non-volatile memory storage in compact electronic devices.

Median Price

$1.590

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 5,280 parts In-Stock

1+ parts

$1.590

100+ parts

$1.460

1k+ parts

$1.380

10k+ parts

$1.290

5,280

$1.590

$1.460

$1.380

$1.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.515

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.515

-

-

-

NAC Semi

USA . 4,320 parts In-Stock

1+ parts

$1.710

100+ parts

$1.540

1k+ parts

$1.390

10k+ parts

-

4,320

$1.710

$1.540

$1.390

-

Vyrian

USA . 7,438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,438

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 8 parts In-Stock

1+ parts

$0.497

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$0.497

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$1.485

100+ parts

-

1k+ parts

$1.425

10k+ parts

-

50

$1.485

-

$1.425

-

AZTECH Wire

Italy . 824 parts In-Stock

1+ parts

$11.600

100+ parts

-

1k+ parts

-

10k+ parts

-

824

$11.600

-

-

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Lixinc

USA . 6,652 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,652

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-

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RGB Technical Solutions

Ukraine . 578 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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578

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Overview

Unlock the power of reliable and high-quality flash memory with Microchip Technology's SST39VF402C-70-4I-B3KE. This innovative product offers unparalleled value, benefits, and advantages for a wide range of applications. With its industrial-grade temperature grade and endurance of 100,000 Write/Erase cycles, this flash memory is perfect for demanding environments where reliability is key. Trust in Microchip Technology's expertise and choose the SST39VF402C-70-4I-B3KE for all your flash memory needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and protection for the flash memory, making it a reliable choice.

Surface Mount:

YES - This feature allows for easy installation and space-saving design, perfect for compact applications.

Package Shape:

RECTANGULAR - The rectangular shape makes it easy to integrate into existing circuit layouts, increasing versatility.

Operating Mode:

ASYNCHRONOUS - This mode offers efficient performance and data transfer speeds, enhancing overall functionality.

Nominal Supply Voltage / Vsup (V):

3 - The 3V supply voltage ensures compatibility with a wide range of devices, making it a versatile option.

Power Supplies (V):

3/3.3 - Dual power supply options provide flexibility and reliability in different operating environments.

No. of Terminals:

48 - The ample number of terminals allows for easy connections and versatile configurations, enhancing usability.

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH - This package style offers high-density storage in a compact design, ideal for space-constrained applications.

Maximum Operating Temperature:

85 °C - With a high operating temperature range, this flash memory can withstand harsh environments, ensuring long-term reliability.

Organization:

256KX16 - The 256KX16 organization offers ample storage capacity for data-intensive applications, making it a suitable choice for various uses.

Technical Specifications

Flash Memory SST39VF402C-70-4I-B3KE attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Access Time:

70 ns

Additional Features:

TOP BOOT BLOCK

Boot Block:

TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Sectors/Size:

1,2,1,7

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

8K,4K,16K,32K

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

6 mm

Trade Compliance

SST39VF402C-70-4I-B3KE Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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