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RECTANGULAR Flash Memory 1,448

Flash Memory
Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Reverse Pinout Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
MX60LF8G18AC-TI by Macronix

MX60LF8G18AC-TI

Macronix

Macronix's MX60LF8G18AC-TI is a 3V SLC NAND flash memory with 1GX8 organization, operating from -40 to 85 °C. It features a small outline package, 0.5mm terminal pitch, and industrial temperature grade suitable for various embedded applications.

R-PDSO-G48

e3

18.4 mm

8589934592 bit

FLASH

8

3

1

48

1073741824 words

1G

ASYNCHRONOUS

85 Cel

-40 Cel

1GX8

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

PARALLEL

3

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

TIN

GULL WING

.5 mm

DUAL

SLC NAND TYPE

12 mm

W25Q80EWZPIG by Winbond Electronics

W25Q80EWZPIG

Winbond Electronics

W25Q80EWZPIG by Winbond Electronics is a NOR type flash memory with 8MX1 organization, operating at 104 MHz. It has a small outline package style and is suitable for industrial applications requiring high endurance with 100000 write/erase cycles. The memory density is 8388608 bits, making it ideal for devices needing reliable data storage in harsh environments.

104 MHz

20

100000 Write/Erase Cycles

R-PDSO-N8

6 mm

8388608 bit

FLASH

1

1

8

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX1

PLASTIC/EPOXY

HVSON

SOLCC8,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

NOT SPECIFIED

1.8

1.8

Not Qualified

.8 mm

SPI

.0000075 Amp

Flash Memories

20 mA

1.95 V

1.65 V

1.8

YES

CMOS

INDUSTRIAL

NO LEAD

1.27 mm

DUAL

NOT SPECIFIED

NOR TYPE

5 mm

HARDWARE/SOFTWARE

W25Q64JVTCIQ by Winbond Electronics

W25Q64JVTCIQ

Winbond Electronics

Winbond Electronics' W25Q64JVTCIQ is a 3.3V NOR Flash Memory with 8MX8 organization, operating at up to 133MHz clock frequency. Ideal for industrial applications, it offers 100000 Write/Erase cycles, SPI serial bus type, and a memory density of 67108864 bits.

IT ALSO OPERATES AT 2.7V @ 104MHZ

1

133 MHz

20

100000 Write/Erase Cycles

R-PBGA-B24

8 mm

67108864 bit

FLASH

8

1

24

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,4X6,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

NOT SPECIFIED

3.3

1.2 mm

SPI

.00005 Amp

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

NOR TYPE

6 mm

HARDWARE/SOFTWARE

W25Q64JVZPIQ by Winbond Electronics

W25Q64JVZPIQ

Winbond Electronics

Winbond Electronics' W25Q64JVZPIQ is a 3.3V NOR flash memory with 8Mx8 organization, SPI serial bus type, and 133MHz clock frequency. Ideal for industrial applications requiring high endurance of 100K write/erase cycles, it offers a compact package style with small outline and very thin profile for space-constrained designs.

IT ALSO OPERATES AT 2.7V @ 104MHZ

1

133 MHz

20

100000 Write/Erase Cycles

R-PDSO-N8

6 mm

67108864 bit

FLASH

8

1

8

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX8

3-STATE

PLASTIC/EPOXY

HVSON

SOLCC8,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

NOT SPECIFIED

3.3

.8 mm

SPI

.00005 Amp

25 mA

3.6 V

3 V

3.3

YES

CMOS

INDUSTRIAL

NO LEAD

1.27 mm

DUAL

NOT SPECIFIED

NOR TYPE

5 mm

HARDWARE/SOFTWARE

MT29F2G08ABBEAHC:E by Micron Technology

MT29F2G08ABBEAHC:E

Micron Technology

FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Type: SLC NAND TYPE;

25 ns

YES

NO

R-PBGA-B63

13 mm

2147483648 bit

FLASH

8

1

2K

63

268435456 words

256M

ASYNCHRONOUS

70 Cel

0 Cel

256MX8

PLASTIC/EPOXY

VFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2K

PARALLEL

1.8

1.8

Not Qualified

YES

1 mm

128K

.00005 Amp

Flash Memories

20 mA

1.95 V

1.7 V

1.8

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

NO

SLC NAND TYPE

10.5 mm

MT28EW01GABA1HJS-0AAT by Micron Technology

MT28EW01GABA1HJS-0AAT

Micron Technology

Micron Technology's MT28EW01GABA1HJS-0AAT is a 64MX16 NOR flash memory with 1073741824 bit density. Operating at -40 to 105 °C, it has a max access time of 105 ns and uses a programming voltage of 3V. Ideal for industrial applications, this flash memory features a small outline package with dual terminals and gull wing form factor.

105 ns

R-PDSO-G56

18.4 mm

1073741824 bit

FLASH

16

1

56

67108864 words

64M

ASYNCHRONOUS

105 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

DUAL

NOT SPECIFIED

NOR TYPE

14 mm

MT28EW01GABA1HPC-0AAT by Micron Technology

MT28EW01GABA1HPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Screening Level: AEC-Q100;

105 ns

R-PBGA-B64

13 mm

1073741824 bit

FLASH

16

1

64

67108864 words

64M

ASYNCHRONOUS

105 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

NOR TYPE

11 mm

MT28EW01GABA1LJS-0AAT by Micron Technology

MT28EW01GABA1LJS-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Width: 14 mm;

105 ns

R-PDSO-G56

18.4 mm

1073741824 bit

FLASH

16

1

56

67108864 words

64M

ASYNCHRONOUS

105 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

DUAL

NOT SPECIFIED

NOR TYPE

14 mm

MT28EW01GABA1LPC-0AAT by Micron Technology

MT28EW01GABA1LPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

105 ns

R-PBGA-B64

13 mm

1073741824 bit

FLASH

16

1

64

67108864 words

64M

ASYNCHRONOUS

105 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOR TYPE

11 mm

MT28EW512ABA1HJS-0AAT by Micron Technology

MT28EW512ABA1HJS-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;

105 ns

8

R-PDSO-G56

18.4 mm

536870912 bit

FLASH

16

1

56

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

DUAL

NOT SPECIFIED

14 mm

MT28EW512ABA1HPC-0AAT by Micron Technology

MT28EW512ABA1HPC-0AAT

Micron Technology

MT28EW512ABA1HPC-0AAT by Micron Technology is a 32MX16 FLASH Memory IC with 536870912 bit memory density. Operating at 105 ns access time, it has a supply voltage range of 2.7V to 3.6V and supports asynchronous mode. Ideal for industrial applications requiring high-speed data storage in compact form factors.

105 ns

8

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28EW512ABA1LJS-0AAT by Micron Technology

MT28EW512ABA1LJS-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Programming Voltage (V): 3;

105 ns

8

R-PDSO-G56

18.4 mm

536870912 bit

FLASH

16

1

56

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

DUAL

NOT SPECIFIED

14 mm

MT28EW512ABA1LPC-0AAT by Micron Technology

MT28EW512ABA1LPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Length: 13 mm;

105 ns

8

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28FW512ABA1HJS-0AAT by Micron Technology

MT28FW512ABA1HJS-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Screening Level: AEC-Q100;

105 ns

R-PDSO-G56

18.4 mm

536870912 bit

FLASH

16

1

56

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

DUAL

NOT SPECIFIED

14 mm

MT28FW512ABA1HPC-0AAT by Micron Technology

MT28FW512ABA1HPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, LOW PROFILE;

105 ns

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

MT28FW512ABA1LJS-0AAT by Micron Technology

MT28FW512ABA1LJS-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;

105 ns

R-PDSO-G56

18.4 mm

536870912 bit

FLASH

16

1

56

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

DUAL

NOT SPECIFIED

14 mm

MT28FW512ABA1LPC-0AAT by Micron Technology

MT28FW512ABA1LPC-0AAT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.4 mm;

105 ns

R-PBGA-B64

13 mm

536870912 bit

FLASH

16

1

64

33554432 words

32M

ASYNCHRONOUS

105 Cel

-40 Cel

32MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

NOT SPECIFIED

3

AEC-Q100

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

11 mm

M29W640GB70N3E by Micron Technology

M29W640GB70N3E

Micron Technology

FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Boot Block: BOTTOM;

70 ns

8

BOTTOM

R-PDSO-G48

18.4 mm

67108864 bit

FLASH

16

1

48

4194304 words

4M

ASYNCHRONOUS

125 Cel

-40 Cel

4MX16

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL

NOT SPECIFIED

3

1.2 mm

3.6 V

2.7 V

3

YES

CMOS

AUTOMOTIVE

GULL WING

.5 mm

DUAL

NOT SPECIFIED

NOR TYPE

12 mm

M58LT128KSB7ZA6E by Micron Technology

M58LT128KSB7ZA6E

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Type: NOR TYPE;

70 ns

BOTTOM

R-PBGA-B64

13 mm

134217728 bit

FLASH

16

1

64

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX16

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

PARALLEL

1.8

1.2 mm

2 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOR TYPE

10 mm

M58LT128KST8ZA6E by Micron Technology

M58LT128KST8ZA6E

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 2 V;

85 ns

TOP

R-PBGA-B64

13 mm

134217728 bit

FLASH

16

1

64

8388608 words

8M

SYNCHRONOUS

85 Cel

-40 Cel

8MX16

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

PARALLEL

1.8

1.2 mm

2 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOR TYPE

10 mm

MX35LF2GE4AB-MI by Macronix

MX35LF2GE4AB-MI

Macronix

The Macronix MX35LF2GE4AB-MI is a 256MX8 SLC NAND flash memory with SPI serial bus, operating at 104 MHz. It has a max clock frequency of 104 MHz and can endure up to 100,000 write/erase cycles. Ideal for industrial applications requiring high-speed data storage in compact form factors.

104 MHz

10

100000 Write/Erase Cycles

R-PDSO-G16

e3

10.3 mm

2147483648 bit

FLASH

8

3

1

16

268435456 words

256M

SYNCHRONOUS

85 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3/3.3

3

Not Qualified

2.65 mm

SPI

.00005 Amp

Flash Memories

30 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

SLC NAND TYPE

7.52 mm

HARDWARE

W25Q20EWSVIG by Winbond Electronics

W25Q20EWSVIG

Winbond Electronics

W25Q20EWSVIG by Winbond Electronics is a NOR flash memory with 2MX1 organization, operating at 104 MHz clock frequency. It features 100000 Write/Erase cycles endurance and SPI serial bus type, suitable for industrial applications requiring high-speed data storage in a compact package.

104 MHz

20

100000 Write/Erase Cycles

R-PDSO-G8

4.9 mm

2097152 bit

FLASH

1

1

8

2097152 words

2M

SYNCHRONOUS

85 Cel

-40 Cel

2MX1

PLASTIC/EPOXY

VSOP

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

SERIAL

NOT SPECIFIED

1.8

1.8

Not Qualified

.9 mm

SPI

.0000075 Amp

Flash Memories

20 mA

1.95 V

1.65 V

1.8

YES

CMOS

INDUSTRIAL

GULL WING

1.27 mm

DUAL

NOT SPECIFIED

NOR TYPE

3.9 mm

HARDWARE/SOFTWARE

MX25R3235FBDIL0 by Macronix

MX25R3235FBDIL0

Macronix

Macronix's MX25R3235FBDIL0 is a NOR flash memory with 4MX8 organization, 80 MHz clock frequency, and SPI serial bus. It operates at -40 to 85 °C, has 100000 Write/Erase Cycles endurance, and is ideal for industrial applications requiring high-speed data storage.

2

80 MHz

20

100000 Write/Erase Cycles

R-PBGA-B12

33554432 bit

FLASH

8

1

12

4194304 words

4M

SYNCHRONOUS

85 Cel

-40 Cel

4MX8

3-STATE

PLASTIC/EPOXY

VFBGA

BGA12,5X7,14/8

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

SERIAL

NOT SPECIFIED

1.8

.52 mm

SPI

.000024 Amp

6 mA

3.6 V

1.65 V

1.8

YES

CMOS

INDUSTRIAL

BALL

.35 mm

BOTTOM

NOT SPECIFIED

NOR TYPE

HARDWARE/SOFTWARE

MX25U51245GMI by Macronix

MX25U51245GMI

Macronix

Macronix's MX25U51245GMI is a 128MX4 NOR flash memory with 133 MHz clock frequency, ideal for industrial applications. Operating at 1.8V, it offers 536870912 bits of memory density in a small outline package measuring 10.3mm x 7.52mm x 2.65mm, making it suitable for space-constrained designs requiring high-speed synchronous operation.

ALSO IT CAN BE CONFIGURED AS 512M X 1 BIT

2

133 MHz

R-PDSO-G16

e3

10.3 mm

536870912 bit

FLASH

4

3

1

16

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX4

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

SERIAL

1.8

2.65 mm

2 V

1.7 V

1.8

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

NOR TYPE

7.52 mm

SST26VF016BT-104V/SM by Microchip Technology

SST26VF016BT-104V/SM

Microchip Technology

SST26VF016BT-104V/SM by Microchip: NOR Flash Memory, 16Mx1 organization, SPI serial bus type. Ideal for industrial applications with -40 to 105°C operating temp range. Features 104MHz clock frequency and 100K write/erase cycles endurance.

104 MHz

100

100000 Write/Erase Cycles

R-PDSO-G8

e3

5.26 mm

16777216 bit

FLASH

1

1

1

8

16777216 words

16M

SYNCHRONOUS

105 Cel

-40 Cel

16MX1

3-STATE

PLASTIC/EPOXY

SOP

SOP8,.3

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.03 mm

SPI

.000025 Amp

25 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

NOR TYPE

5.25 mm

HARDWARE/SOFTWARE

SST26VF032B-104V/MF by Microchip Technology

SST26VF032B-104V/MF

Microchip Technology

SST26VF032B-104V/MF by Microchip: NOR Flash Memory, 3V supply, 104MHz clock freq. Ideal for industrial applications requiring high endurance EEPROM with SPI interface and 4Mx8 organization.

104 MHz

100

100000 Write/Erase Cycles

R-PDSO-N8

e3

6 mm

33554432 bit

EEPROM

8

1

1

8

4194304 words

4M

SYNCHRONOUS

105 Cel

-40 Cel

4MX8

PLASTIC/EPOXY

HVSON

SOLCC8,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

AEC-Q100

.8 mm

SPI

.000045 Amp

30 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

1.27 mm

DUAL

NOR TYPE

5 mm

HARDWARE/SOFTWARE

W25N01GVTBIG by Winbond Electronics

W25N01GVTBIG

Winbond Electronics

Winbond Electronics' W25N01GVTBIG is a 1GX1 SLC NAND Flash Memory with 3V supply, 104 MHz clock frequency, and SPI serial bus. Ideal for industrial applications, it offers 100K write/erase cycles, -40 to 85°C operating range, and compact GRID ARRAY package.

104 MHz

10

100000 Write/Erase Cycles

R-PBGA-B24

8 mm

1073741824 bit

FLASH

1

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

NOT SPECIFIED

3/3.3

3

Not Qualified

1.2 mm

SPI

.00005 Amp

Flash Memories

35 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

SLC NAND TYPE

6 mm

HARDWARE/SOFTWARE

W25N01GVTBIT by Winbond Electronics

W25N01GVTBIT

Winbond Electronics

W25N01GVTBIT by Winbond Electronics is a 1GX1 SLC NAND flash memory with 1073741824-bit density. It operates at 3V, supports SPI serial bus, and has a clock frequency of up to 104 MHz. Ideal for industrial applications requiring high endurance with 100000 write/erase cycles.

104 MHz

10

100000 Write/Erase Cycles

R-PBGA-B24

8 mm

1073741824 bit

FLASH

1

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

NOT SPECIFIED

3/3.3

3

Not Qualified

1.2 mm

SPI

.00005 Amp

Flash Memories

35 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

SLC NAND TYPE

6 mm

HARDWARE/SOFTWARE

W25N01GVTCIG by Winbond Electronics

W25N01GVTCIG

Winbond Electronics

W25N01GVTCIG by Winbond Electronics is a 1G SLC NAND Flash Memory with SPI Serial Bus, offering 100000 Write/Erase Cycles. Operating at 3V, it supports a max Clock Frequency of 104 MHz and has a temperature range of -40 to 85 °C. Ideal for industrial applications requiring high endurance and reliable data storage.

104 MHz

10

100000 Write/Erase Cycles

R-PBGA-B24

8 mm

1073741824 bit

FLASH

1

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

TBGA

BGA24,4X6,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

NOT SPECIFIED

3/3.3

3

Not Qualified

1.2 mm

SPI

.00005 Amp

Flash Memories

35 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

SLC NAND TYPE

6 mm

HARDWARE/SOFTWARE

W25N01GVTCIT by Winbond Electronics

W25N01GVTCIT

Winbond Electronics

W25N01GVTCIT by Winbond Electronics is a 1Gx1 SLC NAND flash memory with 3V nominal voltage, operating at up to 104MHz clock frequency. It features hardware/software write protection and SPI serial bus type, suitable for industrial applications requiring high endurance of 100K cycles.

104 MHz

10

100000 Write/Erase Cycles

R-PBGA-B24

8 mm

1073741824 bit

FLASH

1

1

24

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

TBGA

BGA24,4X6,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

SERIAL

NOT SPECIFIED

3/3.3

3

Not Qualified

1.2 mm

SPI

.00005 Amp

Flash Memories

35 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

SLC NAND TYPE

6 mm

HARDWARE/SOFTWARE

W25N01GVZEIT by Winbond Electronics

W25N01GVZEIT

Winbond Electronics

W25N01GVZEIT by Winbond Electronics is a 1G SLC NAND Flash Memory with SPI Serial Bus, 104 MHz Clock Frequency, and 100K Write/Erase Cycles. Ideal for industrial applications requiring high endurance, it operates at -40 to 85 °C with a supply voltage of 2.7-3.6 V in a small outline package.

104 MHz

10

100000 Write/Erase Cycles

R-PDSO-N8

8 mm

1073741824 bit

FLASH

1

1

8

1073741824 words

1G

SYNCHRONOUS

85 Cel

-40 Cel

1GX1

PLASTIC/EPOXY

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

NOT SPECIFIED

3/3.3

3

Not Qualified

.8 mm

SPI

.00005 Amp

Flash Memories

35 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

NO LEAD

1.27 mm

DUAL

NOT SPECIFIED

SLC NAND TYPE

6 mm

HARDWARE/SOFTWARE

N25Q032A13EF840E by Micron Technology

N25Q032A13EF840E

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;

108 MHz

20

100000 Write/Erase Cycles

R-PDSO-N8

8 mm

33554432 bit

FLASH

8

1

8

4194304 words

4M

SYNCHRONOUS

85 Cel

-40 Cel

4MX8

PLASTIC/EPOXY

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3/3.3

3

Not Qualified

1 mm

SPI

.0001 Amp

Flash Memories

20 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE/SOFTWARE

N25Q032A13EF440F by Micron Technology

N25Q032A13EF440F

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

108 MHz

20

100000 Write/Erase Cycles

R-PDSO-N8

4 mm

33554432 bit

FLASH

8

1

8

4194304 words

4M

SYNCHRONOUS

85 Cel

-40 Cel

4MX8

3-STATE

PLASTIC/EPOXY

HVSON

SOLCC8,.12

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

NOT SPECIFIED

3/3.3

3

Not Qualified

.6 mm

SPI

.0001 Amp

Flash Memories

20 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

NO LEAD

.8 mm

DUAL

NOT SPECIFIED

NOR TYPE

3 mm

HARDWARE/SOFTWARE

MTFDDAK120MBP-1AN1ZABYY by Micron Technology

MTFDDAK120MBP-1AN1ZABYY

Micron Technology

FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Memory Width: 8; Type: MLC NAND TYPE;

LENGTH_MAX

R-XSMA-X22

100.5 mm

1030792151040 bit

FLASH MODULE

8

1

22

128849018880 words

120G

70 Cel

0 Cel

120GX8

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

PARALLEL

5

7.2 mm

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

UNSPECIFIED

SINGLE

MLC NAND TYPE

69.85 mm

MTFDDAK240MBP-1AN16ABYY by Micron Technology

MTFDDAK240MBP-1AN16ABYY

Micron Technology

FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Command User Interface: NO;

NO

NO

R-XXFM-X22

100.45 mm

2061584302080 bit

FLASH MODULE

8

1

22

257698037760 words

240G

70 Cel

0 Cel

240GX8

UNSPECIFIED

XFM

RECTANGULAR

FLANGE MOUNT

5

7 mm

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

UNSPECIFIED

UNSPECIFIED

MLC NAND TYPE

69.85 mm

MTFDDAK240MBP-1AN1ZABYY by Micron Technology

MTFDDAK240MBP-1AN1ZABYY

Micron Technology

FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Memory Width: 8;

LENGTH_MAX

R-XSMA-X22

100.5 mm

2061584302080 bit

FLASH MODULE

8

1

22

257698037760 words

240G

70 Cel

0 Cel

240GX8

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

PARALLEL

5

7.2 mm

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

UNSPECIFIED

SINGLE

MLC NAND TYPE

69.85 mm

MTFDDAK480MBP-1AN16ABYY by Micron Technology

MTFDDAK480MBP-1AN16ABYY

Micron Technology

FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Length: 100.45 mm;

NO

NO

R-XXFM-X22

100.45 mm

4123168604160 bit

FLASH MODULE

8

1

22

515396075520 words

480G

70 Cel

0 Cel

480GX8

UNSPECIFIED

XFM

RECTANGULAR

FLANGE MOUNT

5

7 mm

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

UNSPECIFIED

UNSPECIFIED

MLC NAND TYPE

69.85 mm

MTFDDAK480MBP-1AN1ZABYY by Micron Technology

MTFDDAK480MBP-1AN1ZABYY

Micron Technology

FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL; Package Body Material: UNSPECIFIED;

LENGTH_MAX

R-XSMA-X22

100.5 mm

4123168604160 bit

FLASH MODULE

8

1

22

515396075520 words

480G

70 Cel

0 Cel

480GX8

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

PARALLEL

5

7.2 mm

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

UNSPECIFIED

SINGLE

MLC NAND TYPE

69.85 mm

MTFDDAK800MBP-1AN16ABYY by Micron Technology

MTFDDAK800MBP-1AN16ABYY

Micron Technology

FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; No. of Words Code: 800G;

NO

NO

R-XXFM-X22

100.45 mm

6871947673600 bit

FLASH MODULE

8

1

22

858993459200 words

800G

70 Cel

0 Cel

800GX8

UNSPECIFIED

XFM

RECTANGULAR

FLANGE MOUNT

5

7 mm

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

UNSPECIFIED

UNSPECIFIED

MLC NAND TYPE

69.85 mm

MTFDDAK960MBP-1AN16ABYY by Micron Technology

MTFDDAK960MBP-1AN16ABYY

Micron Technology

FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Code: XFM; Package Shape: RECTANGULAR; Programming Voltage (V): 5;

NO

NO

R-XXFM-X22

100.45 mm

8246337208320 bit

FLASH MODULE

8

1

22

1030792151040 words

960G

70 Cel

0 Cel

960GX8

UNSPECIFIED

XFM

RECTANGULAR

FLANGE MOUNT

5

7 mm

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

UNSPECIFIED

UNSPECIFIED

MLC NAND TYPE

69.85 mm

MTFDDAK960MBP-1AN1ZABYY by Micron Technology

MTFDDAK960MBP-1AN1ZABYY

Micron Technology

FLASH MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V; Parallel or Serial: PARALLEL;

LENGTH_MAX

R-XSMA-X22

100.5 mm

8246337208320 bit

FLASH MODULE

8

1

22

1030792151040 words

960G

70 Cel

0 Cel

960GX8

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

PARALLEL

5

7.2 mm

5.5 V

4.5 V

5

NO

CMOS

COMMERCIAL

UNSPECIFIED

SINGLE

MLC NAND TYPE

69.85 mm

M45PE40S-VMN6P by Micron Technology

M45PE40S-VMN6P

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;

75 MHz

R-PDSO-G8

4.9 mm

2097152 bit

FLASH

8

1

8

262144 words

256K

SYNCHRONOUS

85 Cel

-40 Cel

256KX8

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

SERIAL

2.7

1.75 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

GULL WING

1.27 mm

DUAL

NOR TYPE

3.9 mm

NAND512W3A2SZA6E by Micron Technology

NAND512W3A2SZA6E

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;

35 ns

YES

NO

R-PBGA-B63

e2

11 mm

536870912 bit

FLASH

8

1

4K

63

67108864 words

64M

ASYNCHRONOUS

85 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

TFBGA

BGA63,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

512

PARALLEL

260

3/3.3

3

Not Qualified

YES

1.05 mm

16K

.00005 Amp

Flash Memories

20 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER NICKEL

BALL

.8 mm

BOTTOM

30

NO

SLC NAND TYPE

9 mm

SST26VF064B-104V/SO by Microchip Technology

SST26VF064B-104V/SO

Microchip Technology

SST26VF064B-104V/SO by Microchip is a 64M NOR flash memory with 100000 Write/Erase Cycles. Operating at 3V, it offers a max clock frequency of 104 MHz and supports SPI serial bus type. Ideal for industrial applications requiring reliable data storage in a compact package style.

104 MHz

100

100000 Write/Erase Cycles

R-PDSO-G16

e3

10.3 mm

67108864 bit

FLASH

1

3

1

1

16

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX1

3-STATE

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

260

3

AEC-Q100

2.65 mm

SPI

.000045 Amp

25 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

40

NOR TYPE

7.5 mm

HARDWARE/SOFTWARE

SST26VF064BT-104V/MF by Microchip Technology

SST26VF064BT-104V/MF

Microchip Technology

SST26VF064BT-104V/MF by Microchip: NOR flash memory with 64Mx1 organization, SPI serial bus type, and 104 MHz clock frequency. Ideal for industrial applications requiring high endurance, operating b/w -40 to 105 °C with 100000 write/erase cycles.

104 MHz

100

100000 Write/Erase Cycles

R-PDSO-N8

e3

6 mm

67108864 bit

FLASH

1

1

1

8

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX1

3-STATE

PLASTIC/EPOXY

HVSON

SOLCC8,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

AEC-Q100

.8 mm

SPI

.000045 Amp

25 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

MATTE TIN

NO LEAD

1.27 mm

DUAL

NOR TYPE

5 mm

HARDWARE/SOFTWARE

SST26VF064BT-104V/SO by Microchip Technology

SST26VF064BT-104V/SO

Microchip Technology

SST26VF064BT-104V/SO by Microchip: 64MX1 organization, 104 MHz clock frequency, SPI serial bus type. Ideal for industrial applications requiring NOR flash memory with 100000 write/erase cycles endurance and 67108864 bit memory density.

104 MHz

100

100000 Write/Erase Cycles

R-PDSO-G16

e3

10.3 mm

67108864 bit

FLASH

1

3

1

1

16

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX1

3-STATE

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

260

3

AEC-Q100

2.65 mm

SPI

.000045 Amp

25 mA

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

40

NOR TYPE

7.5 mm

HARDWARE/SOFTWARE

MT28EW01GABA1HPC-1SIT by Micron Technology

MT28EW01GABA1HPC-1SIT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

95 ns

R-PBGA-B64

13 mm

1073741824 bit

FLASH

16

1

64

67108864 words

64M

ASYNCHRONOUS

85 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

11 mm

MT28EW01GABA1LPC-1SIT by Micron Technology

MT28EW01GABA1LPC-1SIT

Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;

95 ns

R-PBGA-B64

13 mm

1073741824 bit

FLASH

16

1

64

67108864 words

64M

ASYNCHRONOUS

85 Cel

-40 Cel

64MX16

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

PARALLEL

260

3

1.4 mm

3.6 V

2.7 V

3

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

11 mm