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W25Q64JVTCIQ

Winbond Electronics

W25Q64JVTCIQ by Winbond Electronics

Winbond Electronics' W25Q64JVTCIQ is a 3.3V NOR Flash Memory with 8MX8 organization, operating at up to 133MHz clock frequency. Ideal for industrial applications, it offers 100000 Write/Erase cycles, SPI serial bus type, and a memory density of 67108864 bits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,544 parts In-Stock

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4,544

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,561 parts In-Stock

1+ parts

$2.093

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3,561

$2.093

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Corohmni

South Africa . 380 parts In-Stock

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$5.747

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AZTECH Wire

Italy . 731 parts In-Stock

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$14.725

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731

$14.725

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Continental Prestige Electronics

USA . 6,734 parts In-Stock

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Argo Parts USA

USA . 2,942 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Elevate your electronics with the W25Q64JVTCIQ by Winbond Electronics. Known for their superior quality and reliability, Winbond Electronics offers a wide range of innovative solutions in the Flash Memory category. This product boasts a high memory density, fast clock frequency, and impressive endurance, making it perfect for industrial applications where performance is key. Upgrade your devices today with the W25Q64JVTCIQ and experience the value and benefits that Winbond Electronics brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the flash memory, ensuring it can withstand various environmental conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates and more efficient communication between the flash memory and the system it is integrated into.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this flash memory can reliably function in industrial environments with high heat levels.

Write Protection: HARDWARE/SOFTWARE

The option for both hardware and software write protection ensures that valuable data stored in the flash memory is secure and cannot be accidentally overwritten.

Maximum Clock Frequency (fCLK): 133 MHz

With a high maximum clock frequency of 133 MHz, this flash memory can process data quickly and efficiently, making it suitable for high-performance applications.

Endurance: 100000 Write/Erase Cycles

The high endurance of 100,000 write/erase cycles ensures the longevity and reliability of the flash memory, making it suitable for frequent data read/write operations.

Technical Specifications

Flash Memory W25Q64JVTCIQ attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Additional Features:

IT ALSO OPERATES AT 2.7V @ 104MHZ

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,4X6,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3.3

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q64JVTCIQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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