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S25FL512SAGMFIG11

Infineon Technologies

S25FL512SAGMFIG11 by Infineon Technologies

S25FL512SAGMFIG11 by Infineon Technologies is a 64MX8 NOR type flash memory with 512753664 bit density. It operates at 3V, has a clock frequency of 133 MHz, and offers 100000 write/erase cycles. Ideal for industrial applications requiring high-speed synchronous operation in small outline packages.

Median Price

$7.143

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 172 parts In-Stock

1+ parts

$6.896

100+ parts

$4.200

1k+ parts

-

10k+ parts

-

172

$6.896

$4.200

-

-

Chip1Stop

Japan . 493 parts In-Stock

1+ parts

$7.390

100+ parts

$6.280

1k+ parts

-

10k+ parts

-

493

$7.390

$6.280

-

-

DigiKey

USA . 99 parts In-Stock

1+ parts

$7.850

100+ parts

$6.767

1k+ parts

$6.363

10k+ parts

$6.202

99

$7.850

$6.767

$6.363

$6.202

Flip Electronics (Authorized)

USA . 19,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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19,023

-

-

-

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Verical

USA . 664 parts In-Stock

1+ parts

-

100+ parts

$8.316

1k+ parts

-

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664

-

$8.316

-

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Rochester

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$4.210

1k+ parts

$3.770

10k+ parts

$3.540

40

-

$4.210

$3.770

$3.540

Arrow

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.550

10k+ parts

$5.511

6

-

-

$5.550

$5.511

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 470 parts In-Stock

1+ parts

$5.700

100+ parts

-

1k+ parts

-

10k+ parts

-

470

$5.700

-

-

-

Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$8.336

100+ parts

-

1k+ parts

-

10k+ parts

-

45

$8.336

-

-

-

Flip Electronics

USA . 16,774 parts In-Stock

1+ parts

-

100+ parts

-

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16,774

-

-

-

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Vyrian

USA . 2,033 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,033

-

-

-

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NAC Semi

USA . 470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.520

10k+ parts

-

470

-

-

$9.520

-

IBS Electronics

USA . 423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.980

10k+ parts

$5.915

423

-

-

$5.980

$5.915

ComSIT Distribution GmbH

Germany . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 193 parts In-Stock

1+ parts

$3.435

100+ parts

-

1k+ parts

-

10k+ parts

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193

$3.435

-

-

-

Corphita

USA . 174 parts In-Stock

1+ parts

$5.400

100+ parts

-

1k+ parts

-

10k+ parts

-

174

$5.400

-

-

-

Semicontronic

India . 2,529 parts In-Stock

1+ parts

$5.430

100+ parts

$5.294

1k+ parts

$5.267

10k+ parts

-

2,529

$5.430

$5.294

$5.267

-

Modulus Dynamics

Lithuania . 5,667 parts In-Stock

1+ parts

$7.425

100+ parts

$7.128

1k+ parts

$6.831

10k+ parts

-

5,667

$7.425

$7.128

$6.831

-

Corohmni

South Africa . 151 parts In-Stock

1+ parts

$7.425

100+ parts

-

1k+ parts

-

10k+ parts

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151

$7.425

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$7.648

100+ parts

$7.265

1k+ parts

$7.265

10k+ parts

-

2,000

$7.648

$7.265

$7.265

-

Component Stockers USA

USA . 1,113 parts In-Stock

1+ parts

$8.120

100+ parts

$7.660

1k+ parts

-

10k+ parts

-

1,113

$8.120

$7.660

-

-

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$8.336

100+ parts

$7.919

1k+ parts

-

10k+ parts

$7.419

450

$8.336

$7.919

-

$7.419

Continental Prestige Electronics

USA . 1,005 parts In-Stock

1+ parts

$8.336

100+ parts

-

1k+ parts

-

10k+ parts

$8.170

1,005

$8.336

-

-

$8.170

Microchip USA

USA . 8,482 parts In-Stock

1+ parts

$27.552

100+ parts

-

1k+ parts

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10k+ parts

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8,482

$27.552

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QUARKTWIN TECHNOLOGY LTD

USA . 5,799 parts In-Stock

1+ parts

-

100+ parts

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5,799

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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100+ parts

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3,500

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Perfect Parts

USA . 2,492 parts In-Stock

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2,492

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Argo Parts USA

USA . 1,295 parts In-Stock

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1,295

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Metaverse IC Inc.

Canada . 261 parts In-Stock

1+ parts

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261

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-

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Kepictronics

USA . 161 parts In-Stock

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161

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Lixinc

USA . 80 parts In-Stock

1+ parts

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80

-

-

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Glotronic Ltd.

UK . 40 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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40

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-

Overview

Unlock the power of reliable and high-quality flash memory with the S25FL512SAGMFIG11 by Infineon Technologies. Designed with precision and expertise, this product offers seamless performance in various applications, making it a versatile choice for your needs. With a focus on value and efficiency, this flash memory ensures optimal data storage and retrieval, providing customers with a dependable solution that delivers exceptional benefits. Trust in the excellence of Infineon Technologies and experience the advantages of superior technology with the S25FL512SAGMFIG11.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for reliable performance.

Operating Mode: SYNCHRONOUS

Provides synchronized data transfer for efficient and fast operation.

Nominal Supply Voltage / Vsup (V): 3

Optimal voltage for stable operation and power efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Write Protection: HARDWARE/SOFTWARE

Offers options for secure data storage and prevents accidental data loss.

Maximum Clock Frequency (fCLK): 133 MHz

High clock frequency allows for quick data access and processing.

Endurance: 100000 Write/Erase Cycles

High endurance ensures longevity and reliability of the flash memory.

Technical Specifications

Flash Memory S25FL512SAGMFIG11 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Alternate Memory Width:

4

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Memory Density:

512753664 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

64094208 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0003 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

7.5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL512SAGMFIG11 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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