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XCZU7EG-1FBVB900E

Xilinx

XCZU7EG-1FBVB900E by Xilinx

XCZU7EG-1FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for applications requiring low voltage (0.825-0.876 V) and high temp (245C) environments.

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MARBEL Systems

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Kenton Components

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Overview

Unleash the power of innovation with the XCZU7EG-1FBVB900E by Xilinx. As a trusted leader in the industry, Xilinx delivers top-quality products that redefine possibilities. This cutting-edge microprocessor circuit opens doors to endless opportunities in various applications. Elevate your projects with the advantages of this product's advanced technology, reliability, and exceptional performance. Experience the value and benefits it brings to your designs, setting you apart from the competition. Choose Xilinx for unparalleled excellence in Other Function uPs,uCs & Peripheral ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures a lightweight and durable construction for the product.

Surface Mount: YES

Being surface mountable makes installation and soldering of the product much easier and efficient.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for stable and reliable operation of the product even under heavy loads.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design for space-saving and efficient PCB layout.

No. of Terminals: 900

With 900 terminals, this product offers high connectivity options for various external components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers better heat dissipation and electrical performance for the product.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures energy efficiency and compatibility with various power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The use of tin/silver/copper as terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on the PCB, ensuring stable connections.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature reduces the risk of component damage during soldering process.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and flexibility for various applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Terminal Form: BALL

Ball terminal form provides excellent electrical connections and mechanical strength for the product.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage ensures stable and optimal performance of the product under normal operating conditions.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product is suitable for surface mount assembly and reflow soldering processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EG-1FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EG-1FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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