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XCZU6CG-1FFVB1156I

Xilinx

XCZU6CG-1FFVB1156I by Xilinx

XCZU6CG-1FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

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Vyrian

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AZTECH Wire

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One Stop Electronics

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Overview

Experience the cutting-edge technology of Xilinx with the XCZU6CG-1FFVB1156I, a top-tier product in the category of Other Function uPs, uCs & Peripheral ICs. With a focus on quality and innovation, Xilinx delivers superior performance and reliability to meet your specific needs. Ideal for a range of applications, this product offers unmatched value and benefits, ensuring seamless integration and optimal functionality. Elevate your projects with the XCZU6CG-1FFVB1156I and experience the difference that Xilinx brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides excellent protection for the internal components of the product, improving durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 0.876 V

With a maximum supply voltage of 0.876 V, this product is designed to operate efficiently and reliably within this voltage range.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement and alignment on circuit boards, optimizing space utilization.

No. of Terminals: 1156

With a high number of terminals, this product offers versatile connectivity options for various applications.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates efficient thermal management and soldering processes, ensuring stable performance under varying conditions.

Minimum Supply Voltage: 0.825 V

A minimum supply voltage of 0.825 V ensures that the product remains operational even under low voltage conditions, enhancing reliability.

Maximum Operating Temperature: 100 °C

Capable of operating at temperatures up to 100°C, this product is suitable for industrial environments where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand cold environments and maintain performance in a wide range of conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/Silver/Copper terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and maintenance processes, making it easier to integrate the product into existing systems.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding peak reflow temperatures for up to 30 seconds, ensuring proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 245

Peak reflow temperature of 245°C allows for efficient soldering and assembly, ensuring strong connections and stable performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is built to withstand harsh environments and operate reliably in demanding conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC type, this product offers advanced processing capabilities and enhanced functionality for various applications.

Technology: CMOS

CMOS technology enables efficient power consumption and high-speed operation, making the product suitable for energy-efficient and high-performance applications.

Terminal Form: BALL

Ball terminal form provides reliable connections and facilitates easy soldering, ensuring stable performance and long-term reliability.

Nominal Supply Voltage: 0.85 V

With a nominal supply voltage of 0.85 V, this product is designed to deliver consistent performance within a specified voltage range.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates that the product can withstand moderate exposure to moisture during storage and handling, ensuring reliability in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU6CG-1FFVB1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU6CG-1FFVB1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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