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XCZU5EG-2FBVB900I

Xilinx

XCZU5EG-2FBVB900I by Xilinx

The Xilinx XCZU5EG-2FBVB900I is a programmable SoC with CMOS technology. It operates in industrial temperature range (-40 to 100 °C) and has 900 terminals on a grid array package. With a supply voltage range of 0.825V to 0.876V, it's suitable for various applications requiring high-performance processing capabilities.

Median Price

$3,614.560

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Nova Conductors

Japan . 500 parts In-Stock

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Vyrian

USA . 8,015 parts In-Stock

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Digiode

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Chip Stock

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VNN

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One Stop Electronics

USA . 1,463 parts In-Stock

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$11.000

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Ampacity Inc.

Singapore . 796 parts In-Stock

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AZTECH Wire

Italy . 238 parts In-Stock

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Modulus Dynamics

Lithuania . 344 parts In-Stock

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Semicontronic

India . 1,309 parts In-Stock

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$30.070

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MARBEL Systems

Belgium . 3,467 parts In-Stock

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$68.312

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Texas Native Microelectronics

USA . 50 parts In-Stock

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$78.520

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$75.379

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Corohmni

South Africa . 2,185 parts In-Stock

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Kenton Components

USA . 158 parts In-Stock

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$94.224

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Microchip USA

USA . 1,728 parts In-Stock

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$2,891.976

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Continental Prestige Electronics

USA . 2,198 parts In-Stock

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Argo Parts USA

USA . 1,902 parts In-Stock

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$3,614.560

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$3,578.414

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$3,542.269

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$3,506.123

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$3,506.123

Vigor

Singapore . 522 parts In-Stock

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Corphita

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Qasali Group International

UK . 279 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$3,433.832

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Supply Digital

USA . 86 parts In-Stock

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Overview

Discover the ultimate solution for your next project with the XCZU5EG-2FBVB900I by Xilinx. This cutting-edge programmable SoC offers unparalleled quality and performance, designed by the trusted manufacturer Xilinx. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this product provides exceptional value and benefits to customers looking for reliability and innovation. Upgrade your design with the XCZU5EG-2FBVB900I and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable material ensures long-term reliability.

Surface Mount:

YES - Easy to install and saves space on PCB.

Maximum Supply Voltage:

0.876 V - Allows for efficient power usage.

Package Shape:

RECTANGULAR - Fits well in standard PCB layouts.

No. of Terminals:

900 - Provides ample connection options for peripherals.

Package Style (Meter):

GRID ARRAY - Ensures stable connection points.

Minimum Supply Voltage:

0.825 V - Allows for low power operation.

Maximum Operating Temperature:

100 °C - Suitable for industrial applications.

Minimum Operating Temperature:

40 °C - Can withstand harsh environmental conditions.

Terminal Finish:

TIN SILVER COPPER - Provides good conductivity and corrosion resistance.

Terminal Position:

BOTTOM - Facilitates easy soldering and connectivity.

Maximum Seated Height:

2.88 mm - Fits well within compact designs.

Width:

31 mm - Allows for easy integration into various systems.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C:

245 - Enables secure soldering connections.

Length:

31 mm - Compact size for space-constrained applications.

Temperature Grade:

INDUSTRIAL - Suitable for demanding environments.

Peripheral IC Type:

PROGRAMMABLE SoC - Offers versatility and customization options.

Technology:

CMOS - Provides efficient power consumption and fast processing.

Terminal Form:

BALL - Facilitates easy soldering and connectivity.

Nominal Supply Voltage:

0.85 V - Optimal voltage for stable performance.

Terminal Pitch:

1 mm - Allows for easy connection to other components.

Moisture Sensitivity Level (MSL):

4 - Suitable for various storage and operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5EG-2FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA900,30X30,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.88 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

31 mm

Peripheral IC Type:

Trade Compliance

XCZU5EG-2FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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