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XIO2200ZGW

Texas Instruments

XIO2200ZGW by Texas Instruments

XIO2200ZGW by Texas Instruments is a bus controller with 176 terminals, operating at 24.576 MHz clock frequency. It supports IEEE1394 and IEEE1394A drive interfaces, ideal for PCI applications in commercial temperature grade environments. The package style is grid array with low profile and fine pitch, suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,263 parts In-Stock

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Digiode

USA . 126 parts In-Stock

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AZTECH Wire

Italy . 349 parts In-Stock

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$15.236

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One Stop Electronics

USA . 584 parts In-Stock

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$31.000

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Parana Technologies

USA . 2,069 parts In-Stock

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$47.804

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DigiPath Technology Company

USA . 259 parts In-Stock

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$52.638

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$48.427

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IDEA Electronic Components Group

UK . 2,162 parts In-Stock

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$53.712

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$51.026

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$48.341

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ChromeModa Solutions

Germany . 1,938 parts In-Stock

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$53.712

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$44.044

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Corohmni

South Africa . 449 parts In-Stock

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$71.990

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Corphita

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Microchip USA

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Overview

Unlock the power of seamless data transfer with the XIO2200ZGW by Texas Instruments. Manufactured with precision and excellence, this bus controller offers unparalleled reliability and performance for a wide range of applications. From consumer electronics to industrial automation, this product delivers unmatched value and benefits to customers seeking high-quality solutions. Experience the advantages of Texas Instruments technology and elevate your projects with the XIO2200ZGW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, ensuring the product will last a long time even in high temperature environments.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 1.65 V

Operates efficiently at a low maximum supply voltage, reducing power consumption and heat generation.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

Power Supplies (V): 1.5,3.3

Supports multiple power supply options, providing flexibility in system design.

No. of Terminals: 176

Offers a high number of terminals for connecting various components, enhancing connectivity.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array and fine pitch design optimize signal integrity and reduce crosstalk, enhancing overall performance.

Minimum Supply Voltage: 1.35 V

Operates at a low minimum supply voltage, saving power and prolonging battery life.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for a wide range of operating conditions.

Minimum Operating Temperature: 0 °C

Operates at low temperatures, ensuring reliability in cold environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and efficient routing of connections.

Maximum Seated Height: 1.4 mm

Low profile design helps in space-constrained applications and reduces overall height of the product.

Width: 15 mm

Compact width size facilitates easy integration into circuit designs with limited space.

Maximum Clock Frequency: 24.576 MHz

High clock frequency supports fast data transfer rates, improving overall system performance.

Length: 15 mm

Compact length size allows for efficient placement on circuit boards.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliability and compatibility with standard operating conditions.

Peripheral IC Type: BUS CONTROLLER, PCI

Specifically designed as a bus controller for PCI interfaces, providing precise control over data transfer.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and performance.

Terminal Form: BALL

Ball terminal form allows for easy soldering and reliable connection with other components.

Nominal Supply Voltage: 1.5 V

Operating at a nominal supply voltage of 1.5V provides a balance between power efficiency and performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density packaging and efficient routing of connections.

Drive Interface Standard: IEEE1394; IEEE1394A

Supports IEEE1394 and IEEE1394A drive interfaces, ensuring compatibility with a wide range of devices and peripherals.

Technical Specifications

Bus Controllers XIO2200ZGW attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Maximum Clock Frequency:

24.576 MHz

Drive Interface Standard:

IEEE1394; IEEE1394A

JESD-30 Code:

S-PBGA-B176

Length:

15 mm

No. of Terminals:

176

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA176,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XIO2200ZGW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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