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PI7C9X2G608GPANJEX

Diodes Incorporated

PI7C9X2G608GPANJEX by Diodes Incorporated

PI7C9X2G608GPANJEX by Diodes Inc. is a Bus Controller IC with 196 terminals, CMOS technology, and industrial temperature grade. It is used in X86, PowerPC, MIPS, ARM systems for PCI bus compatibility applications.

Median Price

$13.897

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$13.897

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43

$13.897

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Vyrian

USA . 1,444 parts In-Stock

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1,444

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,199 parts In-Stock

1+ parts

$7.000

100+ parts

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1,199

$7.000

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AZTECH Wire

Italy . 365 parts In-Stock

1+ parts

$8.541

100+ parts

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365

$8.541

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Corohmni

South Africa . 202 parts In-Stock

1+ parts

$13.897

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202

$13.897

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Continental Prestige Electronics

USA . 6,945 parts In-Stock

1+ parts

$13.897

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1k+ parts

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10k+ parts

$13.619

6,945

$13.897

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$13.619

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$13.897

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1,000

$13.897

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Aztec Data Supply Inc.

USA . 2,713 parts In-Stock

1+ parts

$17.470

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2,713

$17.470

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Semicontronic

India . 720 parts In-Stock

1+ parts

$25.000

100+ parts

$24.375

1k+ parts

$24.250

10k+ parts

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720

$25.000

$24.375

$24.250

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$55.177

100+ parts

$54.625

1k+ parts

$52.418

10k+ parts

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3,000

$55.177

$54.625

$52.418

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Lixinc

USA . 4,971 parts In-Stock

1+ parts

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4,971

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Argo Parts USA

USA . 2,464 parts In-Stock

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2,464

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Microchip USA

USA . 2,310 parts In-Stock

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2,310

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Overview

Experience unparalleled performance and reliability with the PI7C9X2G608GPANJEX by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers top-notch bus controllers that cater to a wide range of applications such as X86, POWERPC, MIPS, ARM, and PCI. With its advanced technology and industrial-grade components, this product ensures seamless connectivity and optimal efficiency. Trust Diodes Incorporated to provide you with a superior solution that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various industrial applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and space in the design of electronic systems.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space on the PCB, ensuring a compact and organized design.

No. of Terminals: 196

Having 196 terminals provides a high level of connectivity and compatibility with a wide range of devices, making the product versatile in usage.

Package Style (Meter): GRID ARRAY

The grid array package style offers a high density of connections in a compact footprint, enhancing the functionality and performance of the bus controller.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the bus controller to function effectively in a wide range of temperature environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections, ensuring stable and efficient data transmission.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the bus controller can operate reliably in rugged industrial environments, making it a dependable choice for industrial applications.

Peripheral IC Type: BUS CONTROLLER, PCI

The bus controller with PCI interface offers high-speed data transfer capabilities and compatibility with various processor architectures, allowing for seamless integration into different systems.

Technology: CMOS

The CMOS technology used in the bus controller ensures low power consumption, high reliability, and compatibility with a wide range of devices, making it an efficient and versatile choice.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections, enhancing the overall durability and performance of the bus controller.

Bus Compatibility: X86; POWERPC; MIPS; ARM; PCI

The bus controller's compatibility with various processor architectures such as X86, POWERPC, MIPS, and ARM, as well as PCI interface, ensures seamless integration with different systems, making it a versatile and adaptable choice for diverse applications.

Technical Specifications

Bus Controllers PI7C9X2G608GPANJEX attributes and parameters. Explore more Bus Controllers devices from Diodes Incorporated

Specs

Bus Compatibility:

X86; POWERPC; MIPS; ARM; PCI

JESD-30 Code:

S-PBGA-B196

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

PI7C9X2G608GPANJEX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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