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VSP2267GSJ

Texas Instruments

VSP2267GSJ by Texas Instruments

VSP2267GSJ by Texas Instruments is a 96-terminal consumer IC with CMOS technology. It operates b/w -25°C to 85°C, suitable for various consumer circuit applications. The package style is grid array, thin profile, fine pitch, making it ideal for compact electronic devices.

Median Price

$7.580

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$6.560

1k+ parts

$5.870

10k+ parts

$5.530

168

-

$6.560

$5.870

$5.530

DigiKey

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$7.580

1k+ parts

-

10k+ parts

-

168

-

$7.580

-

-

Verical

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$8.200

1k+ parts

$7.338

10k+ parts

$6.912

168

-

$8.200

$7.338

$6.912

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,206 parts In-Stock

1+ parts

$6.926

100+ parts

-

1k+ parts

-

10k+ parts

-

2,206

$6.926

-

-

-

Vyrian

USA . 3,221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,221

-

-

-

-

DigiKey Marketplace

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,796 parts In-Stock

1+ parts

$1.153

100+ parts

-

1k+ parts

$1.966

10k+ parts

-

1,796

$1.153

-

$1.966

-

DigiPath Technology Company

USA . 1,044 parts In-Stock

1+ parts

$1.269

100+ parts

$1.168

1k+ parts

-

10k+ parts

-

1,044

$1.269

$1.168

-

-

IDEA Electronic Components Group

UK . 1,658 parts In-Stock

1+ parts

$1.295

100+ parts

-

1k+ parts

$1.166

10k+ parts

-

1,658

$1.295

-

$1.166

-

ChromeModa Solutions

Germany . 645 parts In-Stock

1+ parts

$1.295

100+ parts

$1.062

1k+ parts

-

10k+ parts

-

645

$1.295

$1.062

-

-

Corphita

USA . 3,586 parts In-Stock

1+ parts

$6.561

100+ parts

-

1k+ parts

-

10k+ parts

-

3,586

$6.561

-

-

-

Microchip USA

USA . 326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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326

-

-

-

-

Overview

Discover the innovative VSP2267GSJ by Texas Instruments, a top-tier consumer IC that delivers unmatched quality and performance. With a sleek square package design and advanced CMOS technology, this product is perfect for a wide range of applications. From smart home devices to automotive electronics, the VSP2267GSJ offers reliability and efficiency like no other. Trust in Texas Instruments' reputation for excellence and elevate your projects with the superior capabilities of this cutting-edge IC. Unlock endless possibilities and take your creations to the next level with the VSP2267GSJ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making this product suitable for consumer electronics that require these qualities.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape provides a uniform footprint, making it easier to design the layout on a PCB and optimize space usage.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is well-suited for use in a wide range of electronic devices.

No. of Terminals: 96

With a high number of terminals, this IC can support complex circuit designs and connectivity requirements.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style enhances signal integrity, reduces noise, and allows for high-density mounting.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand a wide range of environmental conditions, ensuring reliable performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows this IC to function efficiently in cold environments without risk of damage or malfunction.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring stable connections over time.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and soldering process, improving assembly efficiency.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2 mm allows for compact and slim device designs, ideal for space-constrained consumer electronics.

Width: 9 mm

The narrow width of 9 mm enables space-efficient PCB layout and integration into small form factor devices.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3 V allows for compatibility with a wide range of power sources, increasing flexibility in design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow and component reliability during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables reliable soldering and thermal stability, especially in lead-free manufacturing processes.

Length: 9 mm

The compact length of 9 mm complements the narrow width, allowing for a more streamlined and efficient PCB layout.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital and analog applications.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and is suitable for advanced mounting techniques, such as ball grid array (BGA).

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm allows for high-density mounting, enabling more connections within a limited space on the PCB.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources and voltage levels, enhancing versatility in application.

Technical Specifications

Other Function Consumer ICs VSP2267GSJ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B96

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

VSP2267GSJ General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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