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V62/04601-01YE

Texas Instruments

V62/04601-01YE by Texas Instruments

V62/04601-01YE by Texas Instruments is a 4-function bus driver with 4.4 ns propagation delay, suitable for automotive applications. It operates at a nominal voltage of 3.3V and features a small outline package style with dual terminal position. With a max operating temperature of 125°C, it offers true output polarity and 3-state output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,588 parts In-Stock

1+ parts

-

100+ parts

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4,588

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Digiode

USA . 1,647 parts In-Stock

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1,647

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 17 parts In-Stock

1+ parts

$9.574

100+ parts

-

1k+ parts

$9.191

10k+ parts

$9.191

17

$9.574

-

$9.191

$9.191

Parana Technologies

USA . 2,354 parts In-Stock

1+ parts

$16.178

100+ parts

-

1k+ parts

$16.500

10k+ parts

-

2,354

$16.178

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$16.500

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AZTECH Wire

Italy . 286 parts In-Stock

1+ parts

$17.258

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286

$17.258

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DigiPath Technology Company

USA . 693 parts In-Stock

1+ parts

$17.813

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693

$17.813

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ChromeModa Solutions

Germany . 5,761 parts In-Stock

1+ parts

$18.177

100+ parts

$14.905

1k+ parts

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5,761

$18.177

$14.905

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IDEA Electronic Components Group

UK . 982 parts In-Stock

1+ parts

$18.177

100+ parts

$17.268

1k+ parts

$16.359

10k+ parts

-

982

$18.177

$17.268

$16.359

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One Stop Electronics

USA . 758 parts In-Stock

1+ parts

$62.000

100+ parts

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758

$62.000

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Corphita

USA . 2,319 parts In-Stock

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2,319

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Overview

Enhance your electronic designs with the V62/04601-01YE by Texas Instruments, a top-notch Bus Driver & Transceiver component known for its superior quality and reliability. Manufactured by a trusted industry leader, this product offers unparalleled performance in various applications. With fast propagation delay and 3-state output characteristics, it provides customers with value and efficiency. Upgrade your projects with the V62/04601-01YE and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the bus driver & transceivers, making it suitable for various environments.

Propagation Delay At Nominal Supply: 4.4 ns

Low propagation delay ensures fast and efficient data transmission, making this product ideal for high-speed bus communication.

Surface Mount: YES

The surface mount feature allows for easy and compact installation on PCBs, saving space and making integration simpler.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, simplifying the design and saving costs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard 3.3V supply voltage ensures compatibility with common power sources and other components in the system.

Load Capacitance (CL): 50 pF

The low load capacitance helps in maintaining signal integrity and reducing transmission errors in the bus communication.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this product can function reliably in harsh environments, making it suitable for automotive applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers V62/04601-01YE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.4 ns

Propagation Delay (tpd):

4.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

V62/04601-01YE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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