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V62/03667-01XE

Texas Instruments

V62/03667-01XE by Texas Instruments

V62/03667-01XE by Texas Instruments is a Bus Driver & Transceiver with 3.8 ns Propagation Delay, 4-bit No. of Bits, and 3.3V Nominal Voltage. It is used in automotive applications due to its small outline package style and CMOS technology for reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,210 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,210

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Vyrian

USA . 3,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,181

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,460 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,460

$3.000

-

-

-

AZTECH Wire

Italy . 671 parts In-Stock

1+ parts

$13.962

100+ parts

-

1k+ parts

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10k+ parts

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671

$13.962

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-

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Parana Technologies

USA . 1,412 parts In-Stock

1+ parts

$29.311

100+ parts

-

1k+ parts

$57.941

10k+ parts

-

1,412

$29.311

-

$57.941

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DigiPath Technology Company

USA . 1,804 parts In-Stock

1+ parts

$32.275

100+ parts

-

1k+ parts

-

10k+ parts

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1,804

$32.275

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-

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ChromeModa Solutions

Germany . 1,648 parts In-Stock

1+ parts

$32.934

100+ parts

$27.006

1k+ parts

-

10k+ parts

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1,648

$32.934

$27.006

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IDEA Electronic Components Group

UK . 1,204 parts In-Stock

1+ parts

$32.934

100+ parts

$31.287

1k+ parts

$29.641

10k+ parts

-

1,204

$32.934

$31.287

$29.641

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Corphita

USA . 897 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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897

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Overview

Enhance your electronic designs with the V62/03667-01XE by Texas Instruments, a high-quality Bus Driver & Transceiver that offers unparalleled performance and reliability. Manufactured by a trusted industry leader, this product is ideal for a wide range of applications. With its advanced features and innovative design, this device provides customers with exceptional value, benefits, and advantages. Experience seamless operation and superior functionality with the V62/03667-01XE, setting new standards in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and is lightweight, making the product durable and easy to handle.

Propagation Delay At Nominal Supply: 3.8 ns

Low propagation delay ensures fast signal transmission and response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one component increases efficiency and simplifies circuit design for the user.

Package Shape: RECTANGULAR

Rectangular shape is standardized and easy to handle, making the product compatible with various board layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Operating within a common voltage range makes integration with other components more straightforward, ensuring compatibility.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, providing flexibility in controlling bus lines and reducing power consumption.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide voltage range, making the product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers V62/03667-01XE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.8 ns

Propagation Delay (tpd):

4.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.3 mm

Trade Compliance

V62/03667-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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