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V62/03607-02YE

Texas Instruments

V62/03607-02YE by Texas Instruments

V62/03607-02YE by Texas Instruments is a 4-bit bus driver with 34ns propagation delay, suitable for automotive applications. It features a 5V nominal voltage, 50pF load capacitance, and operates at temperatures ranging from -40 to 125°C. With a small outline package style and dual terminal position, it offers true output polarity and 3-state output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,979 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,979

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Digiode

USA . 2,309 parts In-Stock

1+ parts

-

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-

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2,309

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,200 parts In-Stock

1+ parts

$4.627

100+ parts

-

1k+ parts

$4.442

10k+ parts

$4.442

1,200

$4.627

-

$4.442

$4.442

One Stop Electronics

USA . 731 parts In-Stock

1+ parts

$8.000

100+ parts

-

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-

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731

$8.000

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AZTECH Wire

Italy . 261 parts In-Stock

1+ parts

$9.720

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-

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261

$9.720

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Parana Technologies

USA . 1,766 parts In-Stock

1+ parts

$18.419

100+ parts

-

1k+ parts

$18.541

10k+ parts

-

1,766

$18.419

-

$18.541

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ChromeModa Solutions

Germany . 2,649 parts In-Stock

1+ parts

$20.696

100+ parts

$16.971

1k+ parts

-

10k+ parts

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2,649

$20.696

$16.971

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IDEA Electronic Components Group

UK . 1,498 parts In-Stock

1+ parts

$20.696

100+ parts

$19.661

1k+ parts

$18.626

10k+ parts

-

1,498

$20.696

$19.661

$18.626

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DigiPath Technology Company

USA . 2,271 parts In-Stock

1+ parts

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100+ parts

$18.660

1k+ parts

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2,271

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$18.660

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Corphita

USA . 164 parts In-Stock

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164

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iodParts Technologies Inc.

India . 110 parts In-Stock

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110

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Overview

Experience superior performance and reliability with the V62/03607-02YE from Texas Instruments, a leading manufacturer in the industry. This bus driver & transceiver is designed for a wide range of applications, offering customers seamless connectivity and efficiency. With its innovative design and high-quality materials, this product ensures optimal functionality and durability. Trust in Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the V62/03607-02YE and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the internal components of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 34 ns

With a low propagation delay at nominal supply, this product ensures fast and efficient signal transmission in bus driver applications.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, making it convenient for manufacturers to integrate into their designs.

No. of Functions: 2

Having two functions in one component adds versatility and functionality to the bus driver & transceivers, making it a cost-effective choice.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signal, allowing for more complex bus driver operations.

Technical Specifications

Bus Driver & Transceivers V62/03607-02YE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

34 ns

Propagation Delay (tpd):

245 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

V62/03607-02YE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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