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V62/03602-01XE

Texas Instruments

V62/03602-01XE by Texas Instruments

V62/03602-01XE by Texas Instruments is a CMOS bus driver with 8 bits, 13.7 ns propagation delay, and 16 Amp max I (ol). It is ideal for automotive applications due to its Schmitt Trigger technology and dual terminal position. The package style is small outline with shrink pitch, making it suitable for surface mount installations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,735

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-

-

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Digiode

USA . 945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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945

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$6.663

100+ parts

-

1k+ parts

$6.397

10k+ parts

$6.397

50

$6.663

-

$6.397

$6.397

AZTECH Wire

Italy . 447 parts In-Stock

1+ parts

$16.804

100+ parts

-

1k+ parts

-

10k+ parts

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447

$16.804

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-

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Parana Technologies

USA . 966 parts In-Stock

1+ parts

$20.046

100+ parts

$1,861.609

1k+ parts

$18.042

10k+ parts

-

966

$20.046

$1,861.609

$18.042

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DigiPath Technology Company

USA . 1,400 parts In-Stock

1+ parts

$22.074

100+ parts

$20.308

1k+ parts

-

10k+ parts

-

1,400

$22.074

$20.308

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ChromeModa Solutions

Germany . 1,466 parts In-Stock

1+ parts

$22.524

100+ parts

$18.470

1k+ parts

-

10k+ parts

-

1,466

$22.524

$18.470

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-

IDEA Electronic Components Group

UK . 629 parts In-Stock

1+ parts

$22.524

100+ parts

$21.398

1k+ parts

$20.272

10k+ parts

-

629

$22.524

$21.398

$20.272

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One Stop Electronics

USA . 300 parts In-Stock

1+ parts

$29.000

100+ parts

-

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300

$29.000

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Corphita

USA . 3,548 parts In-Stock

1+ parts

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3,548

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Overview

Experience superior quality and reliability with the V62/03602-01XE by Texas Instruments, a top-tier manufacturer renowned for cutting-edge technology. This bus driver and transceiver offers seamless communication in various applications, ensuring optimal performance. With its advanced features and durable construction, this product provides exceptional value and benefits to customers seeking efficiency and innovation. Upgrade your systems with the V62/03602-01XE and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection to the internal components of the bus driver and transceiver.

Propagation Delay At Nominal Supply: 13 ns

The low propagation delay ensures fast signal transmission, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mountable makes the installation of this bus driver and transceiver easy and efficient.

No. of Functions: 2

With multiple functions in a single component, this product offers versatility and space-saving benefits in circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package enhances the ease of placement and integration within electronic systems.

No. of Bits: 8

With 8 bits, this product is capable of handling a wide range of digital signals and data processing requirements.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V allows for compatibility with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable and reliable performance in various circuit configurations.

Power Supplies (V): 5

The consistent power supply voltage of 5V ensures reliable operation and performance of the bus driver and transceiver.

No. of Terminals: 48

Having 48 terminals provides enough connectivity options for interfacing with other components and external devices.

Technical Specifications

Bus Driver & Transceivers V62/03602-01XE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Family:

ACT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

13.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.49 mm

Trade Compliance

V62/03602-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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