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V62/03650-01XE

Texas Instruments

V62/03650-01XE by Texas Instruments

V62/03650-01XE by Texas Instruments is an 8-bit bus driver with a propagation delay of 13.5 ns at 3.3V, suitable for military-grade applications. It features a small outline package with a thin profile and shrink pitch, offering dual terminal position and true output polarity. The device operates within a wide temperature range from -55 to 125°C, making it ideal for bidirectional control in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,001 parts In-Stock

1+ parts

-

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1k+ parts

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7,001

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Digiode

USA . 1,043 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,043

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 416 parts In-Stock

1+ parts

$6.762

100+ parts

-

1k+ parts

$6.492

10k+ parts

$6.492

416

$6.762

-

$6.492

$6.492

AZTECH Wire

Italy . 227 parts In-Stock

1+ parts

$7.021

100+ parts

-

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227

$7.021

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Parana Technologies

USA . 1,347 parts In-Stock

1+ parts

$23.289

100+ parts

-

1k+ parts

$23.927

10k+ parts

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1,347

$23.289

-

$23.927

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DigiPath Technology Company

USA . 589 parts In-Stock

1+ parts

$25.644

100+ parts

$23.592

1k+ parts

-

10k+ parts

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589

$25.644

$23.592

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ChromeModa Solutions

Germany . 3,828 parts In-Stock

1+ parts

$26.167

100+ parts

$21.457

1k+ parts

-

10k+ parts

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3,828

$26.167

$21.457

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IDEA Electronic Components Group

UK . 445 parts In-Stock

1+ parts

$26.167

100+ parts

$24.859

1k+ parts

$23.550

10k+ parts

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445

$26.167

$24.859

$23.550

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One Stop Electronics

USA . 1,293 parts In-Stock

1+ parts

$53.000

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1,293

$53.000

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Corphita

USA . 4,015 parts In-Stock

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4,015

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Overview

Discover the unparalleled quality and reliability of the V62/03650-01XE by Texas Instruments, a cutting-edge Bus Driver & Transceiver designed to meet the highest industry standards. With a MILITARY-grade temperature grade and a compact design, this product offers exceptional performance in applications requiring true output polarity and common control. Experience the advantage of seamless integration, precise propagation delay, and 3-STATE output characteristics, making it the perfect choice for your advanced electronic projects. Trust Texas Instruments for innovative solutions that deliver unmatched value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in transportation vehicles.

Propagation Delay At Nominal Supply: 13.5 ns

The low propagation delay ensures fast and efficient data transmission, making this product suitable for time-sensitive applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes the product energy-efficient and compatible with a wide range of power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions, making it suitable for rugged applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it reliable and efficient for long-term use.

Technical Specifications

Bus Driver & Transceivers V62/03650-01XE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

V62/03650-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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