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V62/03607-01XE

Texas Instruments

V62/03607-01XE by Texas Instruments

V62/03607-01XE by Texas Instruments is a 20-terminal bus driver with 34ns propagation delay, suitable for military applications. It operates at a supply voltage of 5V, has a load capacitance of 50pF, and features a max operating temperature of 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,152 parts In-Stock

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3,152

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Vyrian

USA . 2,602 parts In-Stock

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2,602

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Distributors (Availability)

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Andel Nordic

Denmark . 1,200 parts In-Stock

1+ parts

$7.079

100+ parts

-

1k+ parts

$6.796

10k+ parts

$6.796

1,200

$7.079

-

$6.796

$6.796

AZTECH Wire

Italy . 628 parts In-Stock

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$11.151

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628

$11.151

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Parana Technologies

USA . 1,490 parts In-Stock

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$18.354

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$18.481

10k+ parts

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1,490

$18.354

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$18.481

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DigiPath Technology Company

USA . 1,278 parts In-Stock

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$20.210

100+ parts

$18.593

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1,278

$20.210

$18.593

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ChromeModa Solutions

Germany . 3,228 parts In-Stock

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$20.622

100+ parts

$16.910

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3,228

$20.622

$16.910

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IDEA Electronic Components Group

UK . 791 parts In-Stock

1+ parts

$20.622

100+ parts

$19.591

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$18.560

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791

$20.622

$19.591

$18.560

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One Stop Electronics

USA . 431 parts In-Stock

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$24.000

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431

$24.000

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Corphita

USA . 3,106 parts In-Stock

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3,106

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Overview

Experience high-quality performance with the V62/03607-01XE by Texas Instruments, a top-tier manufacturer known for reliability and innovation. As a Bus Driver & Transceiver, this product offers seamless communication in a compact package. Ideal for military-grade applications, this device ensures fast propagation delay and low power consumption, providing customers with efficient solutions for their electronic systems. Trust Texas Instruments for cutting-edge technology that delivers unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and reliability, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 34 ns

The low propagation delay at nominal supply enables fast signal transmission, making this product ideal for time-sensitive applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the circuit board, making it a convenient choice for compact designs.

No. of Functions: 2

With two functions integrated into one component, this product offers cost-effectiveness and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with standard power sources, making it versatile for a wide range of applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable signal transmission, making this product reliable in high-speed communication systems.

Power Supplies (V): 2/6

Supporting power supplies of 2V to 6V, this product is flexible and can be used in various voltage configurations, offering versatility in system integration.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this product offers high performance and reliability in harsh environmental conditions, making it suitable for mission-critical applications.

Technology: CMOS

Utilizing CMOS technology, this product provides low power consumption and high noise immunity, making it energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers V62/03607-01XE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

34 ns

Propagation Delay (tpd):

245 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

V62/03607-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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