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V62/03649-01YE

Texas Instruments

V62/03649-01YE by Texas Instruments

V62/03649-01YE by Texas Instruments is a 20-terminal bus driver with 8.5ns propagation delay, suitable for military applications. It operates at a supply voltage of 3.3V, has a load capacitance of 50pF, and features TRUE output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,874 parts In-Stock

1+ parts

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3,874

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Digiode

USA . 1,585 parts In-Stock

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1,585

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Distributors (Availability)

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Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$10.794

100+ parts

-

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$10.362

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$10.362

50

$10.794

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$10.362

$10.362

One Stop Electronics

USA . 242 parts In-Stock

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$13.000

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242

$13.000

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AZTECH Wire

Italy . 573 parts In-Stock

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$16.014

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573

$16.014

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Parana Technologies

USA . 1,353 parts In-Stock

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$25.252

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$25.884

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1,353

$25.252

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$25.884

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DigiPath Technology Company

USA . 2,256 parts In-Stock

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$27.806

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$25.581

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2,256

$27.806

$25.581

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ChromeModa Solutions

Germany . 1,493 parts In-Stock

1+ parts

$28.373

100+ parts

$23.266

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1,493

$28.373

$23.266

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IDEA Electronic Components Group

UK . 963 parts In-Stock

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$28.373

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$26.954

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$25.536

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963

$28.373

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$25.536

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Perfect Parts

USA . 650 parts In-Stock

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650

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Corphita

USA . 418 parts In-Stock

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Overview

Enhance your electronic projects with the V62/03649-01YE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This bus driver & transceivers category device offers 2 functions and 4 bits, making it versatile for various applications. With a compact design and low propagation delay, this product delivers exceptional performance while maintaining power efficiency. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for transportation and handling in a bus driver application.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast and efficient signal transmission, crucial for real-time communication in bus driver systems.

Surface Mount: YES

Surface mount capability allows for easy and compact installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional chips, simplifying the design and improving reliability.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a low nominal supply voltage of 3.3V helps in reducing power consumption and heat generation, making it energy-efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions, suitable for bus driver applications.

Technology: CMOS

CMOS technology offers high noise immunity, low power consumption, and compatibility with a wide range of voltages, making it a reliable choice for bus driver circuits.

Technical Specifications

Bus Driver & Transceivers V62/03649-01YE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

50 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

V62/03649-01YE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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