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UCC5628QFP

Texas Instruments

UCC5628QFP by Texas Instruments

UCC5628QFP by Texas Instruments is a Data Bus Terminator with 48 terminals, BICMOS technology, and 3.3V supply voltage. It is designed for commercial applications requiring a temperature range of 0-70°C. The package is a square-shaped flatpack made of plastic/epoxy material suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,341 parts In-Stock

1+ parts

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7,341

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Digiode

USA . 2,413 parts In-Stock

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2,413

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 765 parts In-Stock

1+ parts

$10.983

100+ parts

-

1k+ parts

$11.443

10k+ parts

-

765

$10.983

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$11.443

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DigiPath Technology Company

USA . 1,280 parts In-Stock

1+ parts

$12.093

100+ parts

-

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1,280

$12.093

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ChromeModa Solutions

Germany . 5,870 parts In-Stock

1+ parts

$12.340

100+ parts

$10.119

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-

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5,870

$12.340

$10.119

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IDEA Electronic Components Group

UK . 1,896 parts In-Stock

1+ parts

$12.340

100+ parts

$11.723

1k+ parts

$11.106

10k+ parts

-

1,896

$12.340

$11.723

$11.106

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One Stop Electronics

USA . 850 parts In-Stock

1+ parts

$18.500

100+ parts

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850

$18.500

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AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$18.808

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451

$18.808

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Corphita

USA . 2,177 parts In-Stock

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2,177

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Overview

Enhance your data bus performance with the UCC5628QFP by Texas Instruments. Designed with high-quality materials and advanced BICMOS technology, this data bus terminator offers unmatched reliability for a wide range of applications. With its compact square package style and gull wing terminal form, installation is a breeze. From industrial automation to telecommunications, this versatile product guarantees seamless operation in any environment. Upgrade your system today with the UCC5628QFP and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, ensuring a long lifespan of the product.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3

Operates at a standard voltage level of 3.3V, making it compatible with a wide range of devices and systems.

No. of Terminals: 48

Provides ample connectivity options for various devices and components, allowing for versatile integration in different setups.

Maximum Operating Temperature: 70 °C

Capable of functioning reliably even in high-temperature environments, ensuring consistent performance.

Minimum Operating Temperature: 0 °C

Can withstand low-temperature conditions without any negative impact on its functionality, making it suitable for diverse operating environments.

Temperature Grade: COMMERCIAL

Designed and tested for commercial use, meeting industry standards for reliability and performance.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power management and high-speed operation, improving overall product performance.

Nominal Supply Voltage: 3.3 V

Maintains a stable supply voltage of 3.3V, ensuring consistent and reliable operation in various applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density packaging, enabling compact and space-efficient designs.

Technical Specifications

Data Bus Terminators UCC5628QFP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Bus Terminators

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

UCC5628QFP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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