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UCC5606J

Texas Instruments

UCC5606J by Texas Instruments

UCC5606J by Texas Instruments is a SCSI bus terminator with 16 terminals, BICMOS technology, and 3.3V nominal voltage. It operates b/w 0-70°C and has a max seated height of 5.08mm. Ideal for data bus termination applications requiring a pull-up resistance of 110 ohms.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,793 parts In-Stock

1+ parts

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5,793

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Digiode

USA . 1,275 parts In-Stock

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1,275

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,614 parts In-Stock

1+ parts

$2.123

100+ parts

-

1k+ parts

$2.635

10k+ parts

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1,614

$2.123

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$2.635

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DigiPath Technology Company

USA . 415 parts In-Stock

1+ parts

$2.337

100+ parts

$2.150

1k+ parts

-

10k+ parts

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415

$2.337

$2.150

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ChromeModa Solutions

Germany . 2,128 parts In-Stock

1+ parts

$2.385

100+ parts

$1.956

1k+ parts

-

10k+ parts

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2,128

$2.385

$1.956

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IDEA Electronic Components Group

UK . 1,315 parts In-Stock

1+ parts

$2.385

100+ parts

-

1k+ parts

$2.146

10k+ parts

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1,315

$2.385

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$2.146

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AZTECH Wire

Italy . 486 parts In-Stock

1+ parts

$5.122

100+ parts

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486

$5.122

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One Stop Electronics

USA . 187 parts In-Stock

1+ parts

$41.500

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187

$41.500

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Corphita

USA . 1,455 parts In-Stock

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1,455

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Overview

Elevate your data bus performance with the UCC5606J by Texas Instruments. Crafted with precision and expertise, this SCSI bus terminator offers unparalleled quality and reliability. Ideal for a range of applications, this versatile component ensures seamless data transmission in commercial-grade environments. Experience the value of enhanced connectivity and efficiency with the UCC5606J, setting new standards in technology innovation. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to install and fit into standard setups without taking up excessive space.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with common voltage standards and efficient power consumption.

No. of Terminals: 16

With 16 terminals, this data bus terminator can handle a significant number of connections and signals, making it suitable for complex systems.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C ensures reliable performance in a wide range of environmental conditions, including cold temperatures.

Maximum Seated Height: 5.08 mm

The compact maximum seated height allows for easy integration into tight spaces and reduces the overall footprint of the product.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high performance and low power consumption for efficient operation.

No. of Signal Lines: 9

With 9 signal lines, this data bus terminator can handle multiple data streams simultaneously, increasing data transmission efficiency.

Terminal Pitch: 2.54 mm

The standard 2.54mm terminal pitch allows for easy connection and compatibility with a wide range of interface configurations.

Technical Specifications

Data Bus Terminators UCC5606J attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-GDIP-T16

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

UCC5606J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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