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UCC5606PWPG4

Texas Instruments

UCC5606PWPG4 by Texas Instruments

UCC5606PWPG4 by Texas Instruments is a SCSI bus terminator with 24 terminals, 3.3V supply, and 110 ohm pull-up resistance. It operates b/w 0-70°C and has a compact rectangular package suitable for data bus applications. The BICMOS technology and dual terminal position make it ideal for high-speed signal lines in commercial-grade systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,553 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,553

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Digiode

USA . 2,798 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

2,798

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,452 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

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1,452

$2.500

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Parana Technologies

USA . 1,836 parts In-Stock

1+ parts

$3.323

100+ parts

-

1k+ parts

$3.846

10k+ parts

-

1,836

$3.323

-

$3.846

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DigiPath Technology Company

USA . 2,085 parts In-Stock

1+ parts

$3.659

100+ parts

-

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10k+ parts

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2,085

$3.659

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ChromeModa Solutions

Germany . 3,533 parts In-Stock

1+ parts

$3.734

100+ parts

$3.062

1k+ parts

-

10k+ parts

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3,533

$3.734

$3.062

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IDEA Electronic Components Group

UK . 315 parts In-Stock

1+ parts

$3.734

100+ parts

-

1k+ parts

$3.361

10k+ parts

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315

$3.734

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$3.361

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AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$18.192

100+ parts

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424

$18.192

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Corphita

USA . 1,002 parts In-Stock

1+ parts

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1,002

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Overview

Discover the UCC5606PWPG4 by Texas Instruments, a top-tier Data Bus Terminator that guarantees unparalleled quality and reliability. Manufactured by Texas Instruments, a renowned leader in the industry, this product offers exceptional performance in various applications. With its advanced technology and innovative design, this SCSI Bus Terminator provides customers with unmatched value, efficiency, and peace of mind. Trust in Texas Instruments for all your electronic component needs and experience the difference with the UCC5606PWPG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages, making it versatile for different applications.

Minimum Supply Voltage: 2.7 V

Can operate efficiently even at lower supply voltages, increasing its flexibility.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: 0 °C

Operates effectively even at low temperatures, ensuring reliability in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance.

Width: 4.4 mm

Compact width allows for space-efficient integration in electronic systems.

Length: 7.8 mm

Optimal length for fitting into PCB layouts without taking up excess space.

Technology: BICMOS

Utilizes BiCMOS technology for high-speed and low-power operation.

No. of Signal Lines: 9

Supports multiple signal lines for enhanced data transmission capabilities.

Technical Specifications

Data Bus Terminators UCC5606PWPG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

UCC5606PWPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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