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UCC5606NG4

Texas Instruments

UCC5606NG4 by Texas Instruments

UCC5606NG4 by Texas Instruments is a SCSI bus terminator with 16 terminals, BICMOS technology, and 3.3V nominal voltage. It operates b/w 0-70°C and has a pull-up resistance of 110 ohms. Ideal for data bus termination in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,392 parts In-Stock

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4,392

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Digiode

USA . 134 parts In-Stock

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134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,190 parts In-Stock

1+ parts

$5.349

100+ parts

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1k+ parts

$6.017

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1,190

$5.349

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$6.017

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DigiPath Technology Company

USA . 790 parts In-Stock

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$5.890

100+ parts

$5.419

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790

$5.890

$5.419

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ChromeModa Solutions

Germany . 2,274 parts In-Stock

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$6.010

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$4.928

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2,274

$6.010

$4.928

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IDEA Electronic Components Group

UK . 448 parts In-Stock

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$6.010

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$5.409

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448

$6.010

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One Stop Electronics

USA . 160 parts In-Stock

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$17.500

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160

$17.500

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AZTECH Wire

Italy . 678 parts In-Stock

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$18.274

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678

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Corphita

USA . 2,441 parts In-Stock

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Overview

Unlock seamless data transmission with the UCC5606NG4 by Texas Instruments. Crafted with precision and reliability, this data bus terminator offers unparalleled performance in a compact design. Ideal for SCSI applications, this high-quality product ensures smooth signal flow and efficient data transfer. Say goodbye to connectivity issues and experience the benefits of superior technology with the UCC5606NG4. Trust Texas Instruments for cutting-edge solutions that elevate your systems to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 5.25 V

Support for a high maximum supply voltage allows for compatibility with a wide range of devices and systems.

Package Shape: RECTANGULAR

Rectangular shape allows for easy installation and integration into existing setups.

Power Supplies (V): 3.3

Optimal power supply voltage ensures stable performance and reliable operation.

No. of Terminals: 16

Sufficient number of terminals for connecting multiple signal lines and components.

Package Style (Meter): IN-LINE

In-line package style saves space and allows for neat and organized wiring.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures the product can withstand demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of temperature environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and connection options.

Maximum Seated Height: 5.08 mm

Low profile design with maximum seated height allows for installation in compact spaces.

Width: 7.62 mm

Narrow width makes the product suitable for applications with limited space.

Length: 19.305 mm

Optimal length for accommodating multiple signal lines and components within a compact form factor.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Nominal Pull Up Resistance: 110 ohm

Nominal pull up resistance value ensures proper termination of signal lines and prevents signal reflections.

Technology: BICMOS

BICMOS technology offers a balance of high-speed performance and low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connection to the circuit board.

No. of Signal Lines: 9

Sufficient number of signal lines for connecting various components within the system.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures compatibility with standard power sources.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration with other components and devices.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination applications, ensuring optimal signal integrity and data transmission.

Technical Specifications

Data Bus Terminators UCC5606NG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

UCC5606NG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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