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SN74ACT1071

Texas Instruments

SN74ACT1071 by Texas Instruments

SN74ACT1071 by Texas Instruments is a diode bus termination array with 14 terminals in a small outline package. It features gull wing terminal form and is surface mountable. Ideal for data bus termination applications, this device is made of plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,095 parts In-Stock

1+ parts

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7,095

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Digiode

USA . 3,162 parts In-Stock

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3,162

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 310 parts In-Stock

1+ parts

$5.302

100+ parts

-

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310

$5.302

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Parana Technologies

USA . 831 parts In-Stock

1+ parts

$9.898

100+ parts

-

1k+ parts

$10.467

10k+ parts

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831

$9.898

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$10.467

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DigiPath Technology Company

USA . 1,352 parts In-Stock

1+ parts

$10.899

100+ parts

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1,352

$10.899

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ChromeModa Solutions

Germany . 5,788 parts In-Stock

1+ parts

$11.121

100+ parts

$9.119

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-

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5,788

$11.121

$9.119

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IDEA Electronic Components Group

UK . 236 parts In-Stock

1+ parts

$11.121

100+ parts

$10.565

1k+ parts

$10.009

10k+ parts

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236

$11.121

$10.565

$10.009

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One Stop Electronics

USA . 1,019 parts In-Stock

1+ parts

$47.500

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1,019

$47.500

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Corphita

USA . 3,052 parts In-Stock

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3,052

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Overview

Enhance the performance of your electronic devices with the SN74ACT1071 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The SN74ACT1071 falls under the category of Data Bus Terminators, providing essential protection for your data bus systems. With its compact design and versatile terminal positions, this diode bus termination array offers exceptional value and benefits to customers by optimizing signal integrity and preventing data errors. Upgrade your electronics with the SN74ACT1071 for seamless and efficient operation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to temperature variations, making this product suitable for long term use in various environments.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design, making it ideal for applications with limited board space.

No. of Terminals: 14

With 14 terminals, this product provides flexibility in connecting multiple components or devices in a circuit, increasing its compatibility and usability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the board, allowing for efficient component placement and reducing overall system size.

Terminal Position: DUAL

Having dual terminal positions offers versatility in circuit design and layout, enabling different connection configurations to suit varying application requirements.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and reliable electrical contact, ensuring stability and performance in the circuit.

Interface IC Type: DIODE BUS TERMINATION ARRAY

The use of diode bus termination array ensures proper signal termination and protection against signal reflection, enhancing signal integrity and overall system performance.

Technical Specifications

Data Bus Terminators SN74ACT1071 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

SN74ACT1071 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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