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SN74ACT1071DG4

Texas Instruments

SN74ACT1071DG4 by Texas Instruments

SN74ACT1071DG4 by Texas Instruments is a Data Bus Terminator with 10 signal lines, CMOS technology, and 5V nominal voltage. It is used for diode bus termination arrays in industrial applications. The package style is small outline with dual terminal position and nickel palladium gold finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,952 parts In-Stock

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3,952

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Digiode

USA . 1,842 parts In-Stock

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1,842

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 382 parts In-Stock

1+ parts

$4.317

100+ parts

-

1k+ parts

$4.740

10k+ parts

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382

$4.317

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$4.740

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ChromeModa Solutions

Germany . 5,892 parts In-Stock

1+ parts

$4.851

100+ parts

$3.978

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$4.851

$3.978

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IDEA Electronic Components Group

UK . 2,124 parts In-Stock

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$4.851

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$4.366

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$4.851

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$4.366

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AZTECH Wire

Italy . 263 parts In-Stock

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$7.857

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263

$7.857

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One Stop Electronics

USA . 548 parts In-Stock

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$20.500

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548

$20.500

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Corphita

USA . 3,478 parts In-Stock

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DigiPath Technology Company

USA . 602 parts In-Stock

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$4.374

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602

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$4.374

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Overview

Unleash the power of seamless data transfer with the SN74ACT1071DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Data Bus Terminators that guarantee reliable performance and unmatched durability. Ideal for a wide range of applications, this product offers customers the value of efficient signal termination, ensuring smooth communication across all systems. Experience the benefits of Texas Instruments' cutting-edge technology and elevate your projects to new heights with the SN74ACT1071DG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and enabling efficient manufacturing processes.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage ensures compatibility with a wide range of systems and applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing designs or layouts.

Power Supplies (V): 5

Stable power supply at 5V ensures consistent and reliable performance.

No. of Terminals: 14

Sufficient number of terminals for connecting multiple components and devices.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact arrangements on PCBs.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage allows for flexibility in power input options.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures stable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connection options.

Maximum Seated Height: 1.75 mm

Low seated height saves space and allows for compact designs.

Width: 3.9 mm

Narrow width saves space on PCBs and allows for efficient use of available area.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient soldering process during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component bonding.

Length: 8.65 mm

Compact length allows for space-efficient placement on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in harsh working environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering.

No. of Signal Lines: 10

Multiple signal lines allow for efficient data transmission and communication.

Maximum Supply Current: 0.04 mA

Low supply current consumption ensures efficient power usage.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for compact layout and efficient use of space.

Interface IC Type: DIODE BUS TERMINATION ARRAY

Diode bus termination array interface IC type enables efficient and reliable signal termination.

Technical Specifications

Data Bus Terminators SN74ACT1071DG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

10

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Current:

.04 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74ACT1071DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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