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UCC5630FQPTR

Texas Instruments

UCC5630FQPTR by Texas Instruments

UCC5630FQPTR by Texas Instruments is a Data Bus Terminator with 48 terminals, operating voltage range of 2.7V to 5.25V, and BICMOS technology. It features a low profile flatpack package suitable for SCSI bus terminators applications, offering differential outputs and nominal pull-up resistance of 105 ohm. Operating temperature ranges from 0°C to 70°C making it ideal for commercial-grade use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,927 parts In-Stock

1+ parts

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4,927

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Digiode

USA . 625 parts In-Stock

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625

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,168 parts In-Stock

1+ parts

$8.319

100+ parts

-

1k+ parts

$8.942

10k+ parts

-

2,168

$8.319

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$8.942

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DigiPath Technology Company

USA . 232 parts In-Stock

1+ parts

$9.160

100+ parts

$8.427

1k+ parts

-

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232

$9.160

$8.427

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ChromeModa Solutions

Germany . 4,342 parts In-Stock

1+ parts

$9.347

100+ parts

$7.665

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4,342

$9.347

$7.665

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IDEA Electronic Components Group

UK . 1,525 parts In-Stock

1+ parts

$9.347

100+ parts

$8.880

1k+ parts

$8.412

10k+ parts

-

1,525

$9.347

$8.880

$8.412

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AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$14.112

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386

$14.112

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One Stop Electronics

USA . 1,590 parts In-Stock

1+ parts

$28.500

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1,590

$28.500

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Corphita

USA . 252 parts In-Stock

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252

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Overview

Upgrade your data bus system with the UCC5630FQPTR by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers reliable and efficient solutions for your technology needs. The UCC5630FQPTR is a versatile SCSI bus terminator that guarantees optimal performance and compatibility. Say goodbye to connectivity issues and hello to seamless data transmission. Trust Texas Instruments to provide you with the tools you need to stay ahead in the fast-paced world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for long-term use in various conditions.

Surface Mount: YES

The surface mount feature makes installation easy and efficient, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle a wide range of power input, providing versatility in various applications.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement allows for operation in low-power environments, increasing energy efficiency.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for temperature range and performance, ensuring reliability in typical operating conditions.

Differential Output: YES

Differential output helps minimize electromagnetic interference and signal degradation, improving signal quality and reliability in data transmission.

Technical Specifications

Data Bus Terminators UCC5630FQPTR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

UCC5630FQPTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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