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UCC5616PWP

Texas Instruments

UCC5616PWP by Texas Instruments

UCC5616PWP by Texas Instruments is a SCSI bus terminator with 24 terminals, operating b/w 0-70°C. It features a nominal pull-up resistance of 110Ω and requires a supply voltage of 4-5.25V. This small outline package is ideal for data bus termination applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,562 parts In-Stock

1+ parts

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6,562

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Digiode

USA . 361 parts In-Stock

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361

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,190 parts In-Stock

1+ parts

$5.183

100+ parts

$481.354

1k+ parts

$4.665

10k+ parts

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2,190

$5.183

$481.354

$4.665

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DigiPath Technology Company

USA . 595 parts In-Stock

1+ parts

$5.708

100+ parts

-

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595

$5.708

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ChromeModa Solutions

Germany . 4,555 parts In-Stock

1+ parts

$5.824

100+ parts

$4.776

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4,555

$5.824

$4.776

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IDEA Electronic Components Group

UK . 918 parts In-Stock

1+ parts

$5.824

100+ parts

-

1k+ parts

$5.242

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918

$5.824

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$5.242

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AZTECH Wire

Italy . 330 parts In-Stock

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$16.993

100+ parts

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330

$16.993

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One Stop Electronics

USA . 456 parts In-Stock

1+ parts

$30.500

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456

$30.500

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Corphita

USA . 3,285 parts In-Stock

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Overview

Elevate your data bus performance with the UCC5616PWP by Texas Instruments. Expertly crafted using high-quality materials and cutting-edge technology, this SCSI bus terminator offers unparalleled efficiency and reliability. Ideal for a wide range of applications, this product ensures seamless communication and optimal signal integrity. Trust in Texas Instruments to deliver superior solutions that exceed expectations. Experience the value and benefits of the UCC5616PWP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Ease of installation and space-saving design make it convenient for integration into various systems.

Maximum Supply Voltage: 5.25 V

Can handle higher voltages, providing a wider range of compatibility.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and mounting in compact spaces.

No. of Terminals: 24

Sufficient terminals for connecting multiple components in a data bus system.

Minimum Supply Voltage: 4 V

Can operate efficiently even at lower voltage levels, ensuring flexibility in power supply.

Maximum Operating Temperature: 70 °C

High operating temperature range makes it suitable for a variety of environments and applications.

Minimum Operating Temperature: 0 °C

Can withstand low temperatures, ensuring reliable performance in diverse conditions.

Terminal Position: DUAL

Dual terminal position allows for better connectivity and signal transmission.

Maximum Seated Height: 1.2 mm

Low profile design helps in space-constrained installations.

Width: 4.4 mm

Compact width allows for efficient utilization of board space.

Length: 7.8 mm

Optimal length for accommodating multiple terminals and components.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Nominal Pull Up Resistance: 110 ohm

Provides the right amount of resistance to maintain signal integrity.

Terminal Form: GULL WING

Gull wing terminals offer secure soldering and connection for stable performance.

No. of Signal Lines: 9

A sufficient number of signal lines for data transmission and communication.

Nominal Supply Voltage: 4.75 V

Stable supply voltage for consistent operation of the product.

Terminal Pitch: 0.65 mm

Close terminal pitch for compact and efficient board design.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and performance in SCSI systems.

Technical Specifications

Data Bus Terminators UCC5616PWP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

UCC5616PWP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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