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UC5612Z

Texas Instruments

UC5612Z by Texas Instruments

UC5612Z by Texas Instruments is a SCSI bus terminator with 16 terminals. It operates b/w 0-70°C, with supply voltage range of 3.8-5.25 V and pull-up resistance of 110 ohm. Ideal for commercial applications requiring bipolar technology and zig-zag terminal positioning in a compact rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,688 parts In-Stock

1+ parts

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4,688

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Vyrian

USA . 4,408 parts In-Stock

1+ parts

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4,408

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,233 parts In-Stock

1+ parts

$7.332

100+ parts

-

1k+ parts

$7.823

10k+ parts

-

2,233

$7.332

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$7.823

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DigiPath Technology Company

USA . 2,038 parts In-Stock

1+ parts

$8.073

100+ parts

$7.427

1k+ parts

-

10k+ parts

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2,038

$8.073

$7.427

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ChromeModa Solutions

Germany . 3,903 parts In-Stock

1+ parts

$8.238

100+ parts

$6.755

1k+ parts

-

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3,903

$8.238

$6.755

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IDEA Electronic Components Group

UK . 1,446 parts In-Stock

1+ parts

$8.238

100+ parts

-

1k+ parts

$7.414

10k+ parts

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1,446

$8.238

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$7.414

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One Stop Electronics

USA . 1,348 parts In-Stock

1+ parts

$14.500

100+ parts

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1,348

$14.500

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AZTECH Wire

Italy . 241 parts In-Stock

1+ parts

$18.678

100+ parts

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241

$18.678

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Corphita

USA . 4,129 parts In-Stock

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4,129

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Overview

Maximize the performance of your data bus with the UC5612Z by Texas Instruments. This high-quality terminator offers unmatched reliability and precision, thanks to its advanced technology and commercial-grade temperature grade. Perfect for SCSI bus applications, this product ensures seamless data transmission and protection, making it a valuable asset for any project. Trust Texas Instruments to deliver exceptional products that provide superior value and benefits to customers seeking top-notch solutions for their electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term use.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages, making it suitable for a wide range of applications.

Power Supplies (V): 5

Operates at a standard power supply voltage, ensuring compatibility with most systems.

No. of Terminals: 16

Provides ample connection options for various devices and components.

Minimum Operating Temperature: 0 °C

Capable of operating in low-temperature environments, increasing its versatility.

Maximum Seated Height: 7.5 mm

Compact design with a low profile that saves space in the installation.

Nominal Pull Up Resistance: 110 ohm

Offers optimal pull-up resistance for reliable signal transmission.

Technology: BIPOLAR

Utilizes bipolar technology for improved performance and efficiency.

No. of Signal Lines: 9

Provides multiple signal lines for enhanced connectivity and data transmission.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and optimal performance in SCSI systems.

Technical Specifications

Data Bus Terminators UC5612Z attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PZIP-T16

Length:

19.5 mm

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP16,.11

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

7.5 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.8 mm

Trade Compliance

UC5612Z Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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