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UC5601DWPG4

Texas Instruments

UC5601DWPG4 by Texas Instruments

UC5601DWPG4 by Texas Instruments is a Data Bus Terminator with 28 terminals, operating at 0-70°C. It features a supply voltage range of 4-5.25V and offers a pull-up resistance of 110Ω. Ideal for SCSI bus termination applications due to its compact size and Gull Wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,808 parts In-Stock

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Digiode

USA . 4,500 parts In-Stock

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4,500

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Distributors (Availability)

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Parana Technologies

USA . 810 parts In-Stock

1+ parts

$8.989

100+ parts

$834.765

1k+ parts

$8.090

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810

$8.989

$834.765

$8.090

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AZTECH Wire

Italy . 852 parts In-Stock

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$9.058

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$9.058

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DigiPath Technology Company

USA . 506 parts In-Stock

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$9.898

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506

$9.898

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ChromeModa Solutions

Germany . 5,165 parts In-Stock

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$10.100

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$8.282

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5,165

$10.100

$8.282

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IDEA Electronic Components Group

UK . 473 parts In-Stock

1+ parts

$10.100

100+ parts

$9.595

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$9.090

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473

$10.100

$9.595

$9.090

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One Stop Electronics

USA . 521 parts In-Stock

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$25.500

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521

$25.500

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Component Stockers USA

USA . 200 parts In-Stock

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$99.990

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Perfect Parts

USA . 27,484 parts In-Stock

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Microchip USA

USA . 381 parts In-Stock

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Corphita

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Overview

Elevate your data bus systems with the Texas Instruments UC5601DWPG4. Known for their top-notch quality and reliability, Texas Instruments delivers exceptional products that exceed expectations. As a leading manufacturer in the industry, this data bus terminator offers seamless integration and optimal performance for a wide range of applications. Unlock the potential of your systems with the UC5601DWPG4, providing unparalleled value and benefits to customers looking for efficiency and precision in their operations. Trust Texas Instruments to elevate your technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space in the overall design.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration into circuit layouts and designs.

Power Supplies (V): 5

Standard power supply voltage ensures compatibility with most systems.

No. of Terminals: 28

Sufficient number of terminals for connecting multiple components and ensuring proper functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCB and allows for compact designs.

Minimum Supply Voltage: 4 V

Can operate at low supply voltages, suitable for energy-efficient applications.

Maximum Operating Temperature: 70 °C

High operating temperature range allows for use in various environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures, expanding its usability in different settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connection options.

Maximum Seated Height: 2.65 mm

Low seated height helps in maintaining a slim profile and reducing overall size.

Width: 7.5 mm

Narrow width saves space on the PCB and allows for dense packing of components.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable soldering and component attachment.

Length: 17.9 mm

Optimal length for accommodating all terminals and connections without taking up excess space.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Nominal Pull Up Resistance: 110 ohm

Provides the right amount of resistance for proper signal transmission and termination.

Technology: BIPOLAR

Bipolar technology offers stable and reliable performance in data bus termination.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connection to the PCB.

No. of Signal Lines: 18

Sufficient number of signal lines for communicating data effectively within the system.

Nominal Supply Voltage: 4.75 V

Stable nominal supply voltage for consistent performance and signal integrity.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy connections and space-saving design.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates moderate sensitivity to moisture, suitable for indoor use.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and reliable performance in data transmission.

Technical Specifications

Data Bus Terminators UC5601DWPG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

UC5601DWPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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