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UC5602QP

Texas Instruments

UC5602QP by Texas Instruments

UC5602QP by Texas Instruments is a Data Bus Terminator with 5V power supply, 28 terminals, and 110 ohm pull-up resistance. It is a SCSI bus terminator suitable for commercial applications, operating b/w 0-70°C. The chip carrier package style with J bend terminals makes it ideal for surface mount installations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,067 parts In-Stock

1+ parts

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5,067

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Digiode

USA . 4,855 parts In-Stock

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4,855

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Distributors (Availability)

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Parana Technologies

USA . 1,645 parts In-Stock

1+ parts

$12.894

100+ parts

$1,197.433

1k+ parts

$11.605

10k+ parts

-

1,645

$12.894

$1,197.433

$11.605

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DigiPath Technology Company

USA . 869 parts In-Stock

1+ parts

$14.198

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869

$14.198

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ChromeModa Solutions

Germany . 881 parts In-Stock

1+ parts

$14.488

100+ parts

$11.880

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-

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881

$14.488

$11.880

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IDEA Electronic Components Group

UK . 335 parts In-Stock

1+ parts

$14.488

100+ parts

$13.764

1k+ parts

$13.039

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-

335

$14.488

$13.764

$13.039

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AZTECH Wire

Italy . 542 parts In-Stock

1+ parts

$15.892

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542

$15.892

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One Stop Electronics

USA . 1,356 parts In-Stock

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$36.500

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1,356

$36.500

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A-Z Elektronik GmbH

Germany . 5,487 parts In-Stock

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5,487

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Kepictronics

USA . 344 parts In-Stock

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Corphita

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Overview

Elevate your data bus performance with the UC5602QP by Texas Instruments. As a leader in semiconductor innovation, Texas Instruments delivers unmatched quality and reliability in their products. The UC5602QP is a versatile SCSI bus terminator that ensures optimal signal integrity and seamless data transmission. With its advanced technology and commercial-grade temperature tolerance, this chip carrier package offers unparalleled value and benefits to customers looking for superior data bus terminators. Upgrade your system today with the UC5602QP and experience enhanced efficiency and productivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Allows for easy installation and integration on circuit boards.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages without issues, providing a wider operating range.

Minimum Supply Voltage: 4 V

Works effectively even at lower supply voltages, making it versatile for different applications.

Maximum Operating Temperature: 70 °C

Capable of operating in moderate to high temperature environments without overheating.

Terminal Position: QUAD

Quad terminal placement allows for efficient signal routing and connectivity.

Nominal Pull Up Resistance: 110 ohm

Provides the right amount of resistance for signal integrity and noise reduction.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and accuracy for data bus termination.

No. of Signal Lines: 18

Offers compatibility with systems that require multiple signal lines for communication.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and optimal performance.

Technical Specifications

Data Bus Terminators UC5602QP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.5062 mm

Trade Compliance

UC5602QP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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