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UCC5617DWPG4

Texas Instruments

UCC5617DWPG4 by Texas Instruments

UCC5617DWPG4 by Texas Instruments is a SCSI bus terminator with 18 signal lines and 110 ohm pull-up resistance. It operates b/w 0-70°C, with a supply voltage range of 4-5.25V. This BICMOS technology device is ideal for commercial applications requiring data bus terminators in compact form factors.

Median Price

$5.498

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$5.498

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650

$5.498

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Digiode

USA . 4,677 parts In-Stock

1+ parts

-

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4,677

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Vyrian

USA . 3,646 parts In-Stock

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3,646

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 530 parts In-Stock

1+ parts

$3.742

100+ parts

-

1k+ parts

$4.241

10k+ parts

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530

$3.742

-

$4.241

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ChromeModa Solutions

Germany . 6,918 parts In-Stock

1+ parts

$4.205

100+ parts

$3.448

1k+ parts

-

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6,918

$4.205

$3.448

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IDEA Electronic Components Group

UK . 357 parts In-Stock

1+ parts

$4.205

100+ parts

-

1k+ parts

$3.784

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357

$4.205

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$3.784

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AZTECH Wire

Italy . 573 parts In-Stock

1+ parts

$9.870

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573

$9.870

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One Stop Electronics

USA . 1,048 parts In-Stock

1+ parts

$27.500

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1,048

$27.500

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Microchip USA

USA . 4,507 parts In-Stock

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4,507

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Corphita

USA . 4,038 parts In-Stock

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4,038

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DigiPath Technology Company

USA . 197 parts In-Stock

1+ parts

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$3.791

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197

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$3.791

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Overview

Elevate your data bus terminators to a new level of quality and reliability with the UCC5617DWPG4 by Texas Instruments. This innovative product boasts the superior craftsmanship and expertise of a leading manufacturer, ensuring top-notch performance in a variety of applications. From its small outline package style to its dual terminal position, this terminator offers unmatched value and benefits to customers seeking seamless integration and optimal functionality. Say goodbye to performance issues and hello to efficiency with the UCC5617DWPG4 - the ultimate solution for your data bus termination needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the terminator.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages, making it suitable for a variety of applications.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, ensuring reliability in different environments.

No. of Signal Lines: 18

Has a high number of signal lines, allowing for robust data communication and connection options.

Technology: BICMOS

Utilizes BICMOS technology for efficient and reliable operation in data bus termination.

Technical Specifications

Data Bus Terminators UCC5617DWPG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

UCC5617DWPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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