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UCC5681PW28TR

Texas Instruments

UCC5681PW28TR by Texas Instruments

UCC5681PW28TR by Texas Instruments is a SCSI bus terminator with 9 signal lines, BICMOS technology, and 105 ohm pull-up resistance. It operates b/w 0-70°C, has a supply voltage range of 2.7-5.25V, and is designed for surface mount applications in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,158 parts In-Stock

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2,158

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Digiode

USA . 842 parts In-Stock

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842

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,502 parts In-Stock

1+ parts

$4.181

100+ parts

-

1k+ parts

$4.623

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1,502

$4.181

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$4.623

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IDEA Electronic Components Group

UK . 1,457 parts In-Stock

1+ parts

$4.698

100+ parts

-

1k+ parts

$4.228

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1,457

$4.698

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$4.228

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ChromeModa Solutions

Germany . 664 parts In-Stock

1+ parts

$4.698

100+ parts

$3.852

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664

$4.698

$3.852

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AZTECH Wire

Italy . 317 parts In-Stock

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$9.089

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317

$9.089

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One Stop Electronics

USA . 1,050 parts In-Stock

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$20.500

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1,050

$20.500

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DigiPath Technology Company

USA . 831 parts In-Stock

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100+ parts

$4.236

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831

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$4.236

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Corphita

USA . 381 parts In-Stock

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381

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Overview

Enhance your data bus termination with the UCC5681PW28TR by Texas Instruments. This small outline, thin profile package offers high-quality BICMOS technology and a nominal pull-up resistance of 105 ohm for optimal performance. Ideal for SCSI applications, this terminator ensures reliable data transmission with its differential output and dual terminal position. Trust in Texas Instruments' reputation for excellence and invest in the UCC5681PW28TR for superior results in your electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages, making it compatible with various systems and applications.

Minimum Supply Voltage: 2.7 V

Can operate at low supply voltages, increasing flexibility in design and power efficiency.

Terminal Finish: TIN LEAD

Provides good conductivity and solderability for stable connections and signal transmission.

Differential Output: YES

Delivers strong and accurate signal transmission, reducing noise and interference in data communication.

Technology: BICMOS

Combines the benefits of bipolar and CMOS technologies, offering high performance and low power consumption.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and reliable operation in SCSI systems.

Technical Specifications

Data Bus Terminators UCC5681PW28TR attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

UCC5681PW28TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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