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UCC5646PM

Texas Instruments

UCC5646PM by Texas Instruments

UCC5646PM by Texas Instruments is a Data Bus Terminator with 64 terminals, operating at 2.7-5.25V. It features BICMOS technology, quad terminal position, and SCSI interface type for commercial applications requiring fine pitch and low profile packaging.

Median Price

$4.540

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,786 parts In-Stock

1+ parts

-

100+ parts

$3.920

1k+ parts

$3.510

10k+ parts

$3.300

1,786

-

$3.920

$3.510

$3.300

DigiKey

USA . 1,786 parts In-Stock

1+ parts

-

100+ parts

$4.540

1k+ parts

-

10k+ parts

-

1,786

-

$4.540

-

-

Verical

USA . 906 parts In-Stock

1+ parts

-

100+ parts

$4.900

1k+ parts

$4.388

10k+ parts

$4.125

906

-

$4.900

$4.388

$4.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,471 parts In-Stock

1+ parts

$4.152

100+ parts

-

1k+ parts

-

10k+ parts

-

2,471

$4.152

-

-

-

Vyrian

USA . 3,801 parts In-Stock

1+ parts

$4.370

100+ parts

-

1k+ parts

-

10k+ parts

-

3,801

$4.370

-

-

-

DigiKey Marketplace

USA . 1,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,786

-

-

-

-

Prism Electronics

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,689 parts In-Stock

1+ parts

$3.933

100+ parts

-

1k+ parts

-

10k+ parts

-

1,689

$3.933

-

-

-

Parana Technologies

USA . 87 parts In-Stock

1+ parts

$12.588

100+ parts

-

1k+ parts

$13.042

10k+ parts

-

87

$12.588

-

$13.042

-

DigiPath Technology Company

USA . 1,491 parts In-Stock

1+ parts

$13.861

100+ parts

$12.752

1k+ parts

-

10k+ parts

-

1,491

$13.861

$12.752

-

-

ChromeModa Solutions

Germany . 3,169 parts In-Stock

1+ parts

$14.144

100+ parts

$11.598

1k+ parts

-

10k+ parts

-

3,169

$14.144

$11.598

-

-

IDEA Electronic Components Group

UK . 331 parts In-Stock

1+ parts

$14.144

100+ parts

$13.437

1k+ parts

$12.730

10k+ parts

-

331

$14.144

$13.437

$12.730

-

Microchip USA

USA . 490 parts In-Stock

1+ parts

$29.510

100+ parts

$29.330

1k+ parts

$29.240

10k+ parts

$29.150

490

$29.510

$29.330

$29.240

$29.150

Perfect Parts

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Overview

Unlock the power of seamless data transmission with the UCC5646PM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a high-quality Data Bus Terminator that guarantees optimal performance and reliability. Ideal for applications requiring precision and efficiency, this product offers unmatched value and benefits to customers seeking seamless connectivity. Trust Texas Instruments to deliver cutting-edge solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material allows for a lightweight yet durable construction, making this product easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems, providing flexibility in usage.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on circuit boards, optimizing space utilization.

Power Supplies (V): 3/5

The dual power supply options (3V and 5V) make this product versatile and compatible with various power sources.

No. of Terminals: 64

With a high number of terminals, this product can accommodate complex wiring configurations, enhancing connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits and allows for dense packing on circuit boards.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures energy efficiency and extends the product's compatibility with various power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions, increasing product durability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range allows for reliable operation even in cold environments, enhancing product versatility.

Terminal Position: QUAD

The quad terminal position enables easier and more secure connections, reducing the risk of disconnections and signal interference.

Maximum Seated Height: 1.6 mm

The low maximum seated height profile helps in achieving a compact and streamlined design, ideal for space-constrained applications.

Width: 10 mm

The moderate width dimension offers a balance between space efficiency and ease of handling and integration into circuit designs.

Differential Output: YES

The presence of a differential output helps in reducing noise and improving signal quality, ensuring reliable data transmission.

Length: 10 mm

The compact length dimension contributes to a space-saving design, allowing for efficient placement on circuit boards.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, this product meets industry standards for reliability and performance in typical usage scenarios.

Nominal Pull Up Resistance: 105 ohm

The specified pull-up resistance value ensures proper signal integrity and stability, essential for maintaining communication accuracy.

Technology: BICMOS

Utilizing BiCMOS technology offers a balance between performance and power efficiency, enhancing the overall effectiveness of the product.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring strong and reliable connections.

No. of Signal Lines: 27

With a sufficient number of signal lines, this product supports complex communication protocols and data transfer requirements, enhancing system compatibility.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density PCB layouts and precise connections, contributing to efficient circuit design.

Interface IC Type: SCSI BUS TERMINATOR

Designed specifically for SCSI bus termination, this product ensures proper impedance matching and signal termination in SCSI systems, enhancing data transfer reliability.

Technical Specifications

Data Bus Terminators UCC5646PM attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

UCC5646PM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-576-3187, 5962015763187

NIIN

015763187

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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