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IP4771CZ16,118

NXP Semiconductors

IP4771CZ16,118 by NXP Semiconductors

The NXP Semiconductors IP4771CZ16,118 is a data bus terminator with 16 terminals and a small outline, shrink pitch package style. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 5V. This diode bus termination array is suitable for various interface applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,482 parts In-Stock

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Anansix

USA . 1,545 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Vyrian

USA . 245 parts In-Stock

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245

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 256 parts In-Stock

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$3.750

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256

$3.750

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AZTECH Wire

Italy . 3,257 parts In-Stock

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$10.201

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Microchip USA

USA . 170 parts In-Stock

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$11.673

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$11.673

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Corohmni

South Africa . 107 parts In-Stock

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$12.247

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$12.247

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Ampacity Inc.

Singapore . 857 parts In-Stock

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$12.500

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857

$12.500

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Semicontronic

India . 1,358 parts In-Stock

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$23.500

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$22.912

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$22.795

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$22.912

$22.795

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One Stop Electronics

USA . 1,037 parts In-Stock

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$32.500

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Perfect Parts

USA . 5,712 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,964 parts In-Stock

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Continental Prestige Electronics

USA . 3,015 parts In-Stock

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Argo Parts USA

USA . 2,108 parts In-Stock

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Corphita

USA . 2,045 parts In-Stock

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Supply Digital

USA . 181 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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Glotronic Ltd.

UK . 40 parts In-Stock

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Bastille Electronics

Australia . 35 parts In-Stock

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Overview

Experience superior quality and performance with the IP4771CZ16,118 by NXP Semiconductors. As a trusted manufacturer in the industry, NXP Semiconductors delivers cutting-edge solutions for data bus terminators. This compact and versatile product offers countless benefits and advantages to customers. Its small outline and shrink pitch package shape make it easy to integrate into any application. With a wide operating temperature range of -40 °C to 85 °C, this diode bus termination array is perfect for industrial use. Don't compromise on excellence – choose the IP4771CZ16,118 for unparalleled value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with plastic/epoxy material, which makes it durable and resistant to harsh environments, making it a reliable choice for data bus terminators.

Surface Mount: YES

With surface mount capability, this product can be easily mounted on PCBs, providing convenience and flexibility during installation.

No. of Functions: 1

This data bus terminator offers one function, simplifying the design and reducing complexity, making it an efficient solution.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and fitting into standardized equipment, enabling seamless compatibility.

No. of Terminals: 16

With 16 terminals, this data bus terminator provides sufficient connectivity options, accommodating various systems and ensuring reliable data transmission.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline, shrink pitch package style saves valuable space on the circuit board, enabling compact designs and optimizing layout efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that this data bus terminator can withstand demanding conditions, enhancing its reliability and performance.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this product remains functional even in cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and easy connection, allowing for efficient integration and reliable signal transmission.

Maximum Seated Height: 1.73 mm

With a low maximum seated height, this data bus terminator can be installed in tight spaces or stacked arrangements without causing interference, offering design versatility.

Width: 3.9 mm

The compact width of 3.9 mm enables this product to fit in narrow spaces, optimizing board space usage and enabling the design of compact systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds avoids excessive heat exposure, mitigating the risk of damage during assembly and ensuring a successful manufacturing process.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this data bus terminator can undergo high-temperature soldering processes, ensuring reliable solder joints and secure connections.

Length: 4.9 mm

The compact length of 4.9 mm allows this data bus terminator to occupy minimal space on PCBs, enabling more efficient designs and improving overall system performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh operating conditions and maintain optimal functionality, making it a robust choice for data bus terminators.

Terminal Form: GULL WING

The gull wing terminal form ensures secure connections with the PCB, reducing the risk of disconnections and enhancing the data bus terminator's reliability.

No. of Signal Lines: 1

This data bus terminator supports one signal line, simplifying the wiring configuration and making it suitable for single-line communication systems.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this product ensures compatibility with standard voltage levels, enabling easy integration into existing systems.

Terminal Pitch: 0.635 mm

The terminal pitch of 0.635 mm allows for precise and accurate placement on the PCB, reducing the risk of misalignments and ensuring reliable connections.

Moisture Sensitivity Level (MSL): 1

With an MSL of 1, this product has low moisture sensitivity, ensuring its reliability and minimizing the risk of damage during storage or assembly.

Interface IC Type: DIODE BUS TERMINATION ARRAY

This data bus terminator features a diode bus termination array interface IC type, providing effective impedance matching and ensuring optimal signal quality, making it an excellent choice for data bus applications.

Technical Specifications

Data Bus Terminators IP4771CZ16,118 attributes and parameters. Explore more Data Bus Terminators devices from NXP Semiconductors

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.73 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

IP4771CZ16,118 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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