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UCC5647FQP

Texas Instruments

UCC5647FQP by Texas Instruments

UCC5647FQP by Texas Instruments is a 64-terminal data bus terminator with a supply voltage range of 2.7V to 5.25V. It features a low profile flatpack package style, operates in temperatures from 0°C to 70°C, and offers differential output for SCSI bus termination applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,822 parts In-Stock

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3,822

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Digiode

USA . 853 parts In-Stock

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853

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 88 parts In-Stock

1+ parts

$6.525

100+ parts

-

1k+ parts

$7.267

10k+ parts

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88

$6.525

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$7.267

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ChromeModa Solutions

Germany . 2,290 parts In-Stock

1+ parts

$7.332

100+ parts

$6.012

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2,290

$7.332

$6.012

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IDEA Electronic Components Group

UK . 60 parts In-Stock

1+ parts

$7.332

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-

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$6.599

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60

$7.332

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$6.599

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AZTECH Wire

Italy . 823 parts In-Stock

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$12.420

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823

$12.420

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One Stop Electronics

USA . 762 parts In-Stock

1+ parts

$22.500

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762

$22.500

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Corphita

USA . 3,255 parts In-Stock

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3,255

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DigiPath Technology Company

USA . 2,369 parts In-Stock

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$6.611

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2,369

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$6.611

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Overview

Experience unparalleled performance and reliability with the Texas Instruments UCC5647FQP, a top-of-the-line Data Bus Terminator designed to meet all your connectivity needs. Crafted with precision and expertise by Texas Instruments, this product ensures seamless communication and enhanced signal integrity in various applications. Trust in the quality and innovation of Texas Instruments as you unlock the full potential of your electronic devices with the UCC5647FQP. Elevate your projects to new heights with this cutting-edge technology that offers unmatched value and benefits to customers seeking unparalleled connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 5.25 V

Supports a wide range of applications and ensures compatibility with various systems.

Minimum Supply Voltage: 2.7 V

Allows for operation in low-power environments, offering flexibility in usage.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature conditions, making it suitable for various environments.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures without any issues, expanding its usability in different settings.

No. of Signal Lines: 27

Offers a sufficient number of signal lines for efficient data transfer and communication between devices.

Technical Specifications

Data Bus Terminators UCC5647FQP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Nominal Pull Up Resistance:

125 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

UCC5647FQP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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