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CD40117BMG4

Texas Instruments

CD40117BMG4 by Texas Instruments

CD40117BMG4 by Texas Instruments is a Data Bus Terminator with 2 functions, operating at -55 to 125 °C. It has a supply voltage range of 3-18 V and comes in a small outline package. Ideal for military-grade applications requiring CMOS technology and GULL WING terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,855 parts In-Stock

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Digiode

USA . 226 parts In-Stock

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Native Components

USA . 231 parts In-Stock

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$0.056

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$0.053

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AZTECH Wire

Italy . 407 parts In-Stock

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$10.240

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Parana Technologies

USA . 1,667 parts In-Stock

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$11.116

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$11.570

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DigiPath Technology Company

USA . 193 parts In-Stock

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$12.240

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$11.261

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$11.261

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ChromeModa Solutions

Germany . 2,196 parts In-Stock

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$12.490

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$10.242

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$12.490

$10.242

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IDEA Electronic Components Group

UK . 1,677 parts In-Stock

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$12.490

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$11.866

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$11.241

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One Stop Electronics

USA . 1,506 parts In-Stock

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$43.500

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Component Stockers USA

USA . 339 parts In-Stock

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$99.990

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Corphita

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Northwest PG Solutions

USA . 509 parts In-Stock

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Microchip USA

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Overview

Elevate your data bus terminators with the CD40117BMG4 by Texas Instruments. Renowned for their top-notch quality and cutting-edge technology, Texas Instruments delivers a product that exceeds industry standards. Ideal for a wide range of applications, this small outline package offers customers unmatched value and reliability. Say goodbye to compromised performance and hello to seamless data transmission with the CD40117BMG4. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring long-lasting performance.

Surface Mount: YES

Enables easy and efficient installation onto circuit boards, saving time and effort.

Maximum Supply Voltage: 18 V

Allows for compatibility with a wide range of power sources, increasing versatility.

No. of Functions: 2

Offers dual functionality, enhancing the product's efficiency and performance capabilities.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs, improving overall system compatibility.

Power Supplies (V): 5/15

Supports multiple power input options, providing flexibility for different system requirements.

No. of Terminals: 14

Provides ample connectivity options for various signal lines, ensuring effective data transmission.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on circuit boards, ideal for applications with limited area.

Minimum Supply Voltage: 3 V

Operates efficiently even at low power levels, ensuring reliable performance in diverse environments.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for use in industrial or extreme conditions.

Minimum Operating Temperature: -55 °C

Capable of functioning in very low temperatures, making it suitable for harsh environments.

Terminal Position: DUAL

Enhances signal integrity and reduces interference, improving overall data transmission quality.

Maximum Seated Height: 1.75 mm

Low profile design ensures compatibility with compact devices, enabling versatile application.

Width: 3.9 mm

Compact width allows for efficient board layout and space-saving installation.

Length: 8.65 mm

Optimal length for fitting into standard circuit layouts, enhancing overall system design.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and durability, suitable for mission-critical applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed data processing, improving energy efficiency.

Terminal Form: GULL WING

Gull wing terminals provide secure connections with circuit boards, ensuring stable signal transmission.

No. of Signal Lines: 4

Supports multiple signal lines for enhanced data communication, enabling complex system configurations.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with most electronic devices, ensuring widespread applicability.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for efficient board layout and connectivity, enhancing overall system performance.

Interface IC Type: OTHER TERMINATOR

Specialized interface IC type designed for termination applications, ensuring precise signal termination.

Technical Specifications

Data Bus Terminators CD40117BMG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

2

No. of Signal Lines:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD40117BMG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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