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CD40117BH

Texas Instruments

CD40117BH by Texas Instruments

CD40117BH by Texas Instruments is a CMOS data bus terminator with 2 functions. It operates b/w -55 to 125 °C and supports up to 18 V supply voltage. Ideal for military applications, this surface-mount chip has 14 terminals and is designed for signal line termination.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,239 parts In-Stock

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Vyrian

USA . 2,618 parts In-Stock

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2,618

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Distributors (Availability)

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Native Components

USA . 366 parts In-Stock

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$0.890

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366

$0.890

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Northwest PG Solutions

USA . 1,288 parts In-Stock

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$0.979

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$0.979

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AZTECH Wire

Italy . 587 parts In-Stock

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$5.810

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587

$5.810

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Parana Technologies

USA . 2,303 parts In-Stock

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$12.445

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$12.884

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2,303

$12.445

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$12.884

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DigiPath Technology Company

USA . 435 parts In-Stock

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$13.703

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$12.607

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435

$13.703

$12.607

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ChromeModa Solutions

Germany . 3,833 parts In-Stock

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$13.983

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$11.466

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3,833

$13.983

$11.466

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IDEA Electronic Components Group

UK . 2,104 parts In-Stock

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$13.983

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$13.284

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$12.585

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2,104

$13.983

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One Stop Electronics

USA . 935 parts In-Stock

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$38.500

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Corphita

USA . 3,646 parts In-Stock

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Overview

Upgrade your data bus systems with the CD40117BH by Texas Instruments. This high-quality product offers superior performance and reliability for a variety of applications. With its advanced technology and military-grade temperature grade, this terminator ensures optimal functionality in extreme conditions. Trust Texas Instruments to deliver unmatched value and benefits, providing you with the competitive edge you need. Upgrade to the CD40117BH and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs and saves space, making it convenient for compact designs.

Maximum Supply Voltage: 18 V

Can handle a wide range of supply voltages, providing flexibility in different operating conditions.

No. of Functions: 2

Provides multiple functions in a single package, simplifying the design and reducing component count.

Package Style: UNCASED CHIP

Uncased chip design offers a compact form factor and enables direct mounting on the circuit board.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, ensuring reliable operation in harsh environments.

Minimum Operating Temperature: -55 °C

Can operate in extremely cold temperatures, making it suitable for a wide range of applications.

Temperature Grade: MILITARY

Designed to meet stringent military specifications for reliable performance in demanding conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage compatibility makes it easy to integrate into existing systems.

Interface IC Type: OTHER TERMINATOR

Specifically designed as a terminator for data bus interfaces, ensuring compatibility and signal integrity.

Technical Specifications

Data Bus Terminators CD40117BH attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-XUUC-N14

No. of Functions:

2

No. of Signal Lines:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

CD40117BH Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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