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CMCPCI102BR

Onsemi

CMCPCI102BR by Onsemi

CMCPCI102BR by Onsemi is a Data Bus Terminator with 28 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 3-5.5 V and features GULL WING terminals for industrial applications requiring a small outline package design.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 52,985 parts In-Stock

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Digiode

USA . 1,368 parts In-Stock

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Velocity Electronics

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Bristol Electronics

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Native Components

USA . 123 parts In-Stock

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Northwest PG Solutions

USA . 1,858 parts In-Stock

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 7,389 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,103 parts In-Stock

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Kulean Microsystems

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Alle Elektronik GmbH

Germany . 4,735 parts In-Stock

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SupplyDigital Components

Austria . 3,146 parts In-Stock

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Corphita

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Problanco Electronics

Mexico . 2,084 parts In-Stock

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UHIMA Technologies

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Microchip USA

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Corohmni

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Overview

Experience seamless data transmission with the CMCPCI102BR by Onsemi. Crafted with precision and quality in mind, this Data Bus Terminator is designed to enhance the performance of your electronic devices. With a wide operating temperature range and a compact package style, this product offers exceptional value and reliability. Ideal for industrial applications, this terminator ensures optimal signal integrity and efficiency. Upgrade your systems today with the CMCPCI102BR and enjoy the benefits of superior connectivity and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable ensures easy installation and compatibility with modern circuit board designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage makes this product suitable for a wide range of applications and provides flexibility in power requirements.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and integration into compact electronic systems.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is designed to withstand harsh operating conditions, making it reliable in various environments.

Nominal Pull Up Resistance: 10 ohm

The low pull-up resistance helps in maintaining signal integrity and efficient data transmission within the system.

Technical Specifications

Data Bus Terminators CMCPCI102BR attributes and parameters. Explore more Data Bus Terminators devices from Onsemi

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

10

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Nominal Pull Up Resistance:

10 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CMCPCI102BR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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