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UCC5611N

Texas Instruments

UCC5611N by Texas Instruments

UCC5611N by Texas Instruments is a SCSI bus terminator with 18 signal lines and 110 ohm pull-up resistance. It operates b/w 0-70°C, with supply voltage range of 2.75-7V. This BICMOS technology device comes in an inline package suitable for commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,630 parts In-Stock

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6,630

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Digiode

USA . 3,745 parts In-Stock

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3,745

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 419 parts In-Stock

1+ parts

$4.500

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419

$4.500

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AZTECH Wire

Italy . 337 parts In-Stock

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$5.902

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337

$5.902

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Parana Technologies

USA . 1,524 parts In-Stock

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$6.311

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$7.060

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1,524

$6.311

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$7.060

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DigiPath Technology Company

USA . 989 parts In-Stock

1+ parts

$6.949

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$6.393

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989

$6.949

$6.393

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IDEA Electronic Components Group

UK . 2,365 parts In-Stock

1+ parts

$7.091

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$6.382

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2,365

$7.091

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$6.382

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ChromeModa Solutions

Germany . 224 parts In-Stock

1+ parts

$7.091

100+ parts

$5.815

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224

$7.091

$5.815

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Corphita

USA . 315 parts In-Stock

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315

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Overview

Enhance your data bus system with the UCC5611N by Texas Instruments, a top-quality SCSI bus terminator that offers unmatched reliability and performance. Manufactured with precision and expertise, this innovative product ensures seamless communication within your network, delivering exceptional value and efficiency. Ideal for a wide range of applications, the UCC5611N is a must-have for any professional looking to optimize their data transmission process. Upgrade your system today and experience the benefits of cutting-edge technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product long-lasting and reliable.

Maximum Supply Voltage: 7 V

The high maximum supply voltage allows for flexibility in power input options, accommodating various systems.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and easy to integrate into different setups or designs.

Power Supplies (V): 3/5

Provides options for power supply voltage, allowing compatibility with different systems.

No. of Terminals: 24

Sufficient terminals for connecting multiple signal lines efficiently.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for easy installation in tight spaces.

Minimum Supply Voltage: 2.75 V

The low minimum supply voltage ensures compatibility with systems that have lower power requirements.

Maximum Operating Temperature: 70 °C

Capable of operating in a wide range of temperatures, suitable for various environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without issues, increasing its versatility.

Terminal Position: DUAL

Dual terminal position allows for better signal transmission and connection reliability.

Maximum Seated Height: 5.08 mm

Low seated height minimizes space requirements and allows for compact installations.

Width: 15.24 mm

Compact width for easy integration into different setups.

Length: 31.75 mm

Moderate length for accommodating the required number of terminals and components.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where temperature fluctuations are moderate.

Nominal Pull Up Resistance: 110 ohm

Provides the optimal resistance for efficient signal transmission and termination.

Technology: BICMOS

Utilizes BiCMOS technology for a balance of speed and power efficiency in data transmission.

Terminal Form: THROUGH-HOLE

Through-hole terminals for secure and reliable connections.

No. of Signal Lines: 18

Sufficient signal lines for connecting multiple devices, ensuring smooth data transmission.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures compatibility with a wide range of systems.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy connection and compatibility with various setups.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring optimal performance in SCSI setups.

Technical Specifications

Data Bus Terminators UCC5611N attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

31.75 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

7 V

Minimum Supply Voltage:

2.75 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

UCC5611N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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