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UCC561DP

Texas Instruments

UCC561DP by Texas Instruments

UCC561DP by Texas Instruments is a data bus terminator with 16 terminals and a package style of small outline. It operates b/w 0 to 70°C, with a supply voltage range of 2.7V to 5.25V. Ideal for applications requiring bus terminator support circuits in commercial-grade environments.

Median Price

$1.712

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 160 parts In-Stock

1+ parts

$1.725

100+ parts

-

1k+ parts

$0.420

10k+ parts

-

160

$1.725

-

$0.420

-

Rochester

USA . 9,698 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.370

10k+ parts

$1.290

9,698

-

$1.530

$1.370

$1.290

Verical

USA . 7,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.712

10k+ parts

$1.613

7,200

-

-

$1.712

$1.613

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.010

10k+ parts

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500

-

-

$2.010

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Chip1Stop

Japan . 160 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.620

10k+ parts

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160

-

-

$1.620

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,640 parts In-Stock

1+ parts

$0.420

100+ parts

-

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2,640

$0.420

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-

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Digiode

USA . 1,154 parts In-Stock

1+ parts

$1.615

100+ parts

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1,154

$1.615

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-

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DigiKey Marketplace

USA . 500 parts In-Stock

1+ parts

-

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500

-

-

-

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Bristol Electronics

USA . 196 parts In-Stock

1+ parts

-

100+ parts

$2.195

1k+ parts

$2.038

10k+ parts

-

196

-

$2.195

$2.038

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Cyclops Electronics Ltd

UK . 105 parts In-Stock

1+ parts

-

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105

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R&J Components

USA . 89 parts In-Stock

1+ parts

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89

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LWI Electronics Inc

India . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,956 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

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1,956

$1.530

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-

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Parana Technologies

USA . 823 parts In-Stock

1+ parts

$12.038

100+ parts

-

1k+ parts

$12.444

10k+ parts

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823

$12.038

-

$12.444

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DigiPath Technology Company

USA . 2,181 parts In-Stock

1+ parts

$13.255

100+ parts

$12.195

1k+ parts

-

10k+ parts

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2,181

$13.255

$12.195

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ChromeModa Solutions

Germany . 6,716 parts In-Stock

1+ parts

$13.526

100+ parts

$11.091

1k+ parts

-

10k+ parts

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6,716

$13.526

$11.091

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IDEA Electronic Components Group

UK . 1,080 parts In-Stock

1+ parts

$13.526

100+ parts

$12.850

1k+ parts

$12.173

10k+ parts

-

1,080

$13.526

$12.850

$12.173

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QUARKTWIN TECHNOLOGY LTD

USA . 23,435 parts In-Stock

1+ parts

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23,435

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 6,506 parts In-Stock

1+ parts

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6,506

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-

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Kepictronics

USA . 3,189 parts In-Stock

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3,189

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ChipstoGo Electronic ltd

UK . 2,011 parts In-Stock

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2,011

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Metaverse IC Inc.

Canada . 2,011 parts In-Stock

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2,011

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-

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Microchip USA

USA . 1,462 parts In-Stock

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1,462

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Overview

Elevate your data bus performance with the UCC561DP by Texas Instruments. Manufactured with precision and reliability, this data bus terminator offers unparalleled quality for your electronic devices. Whether you're in the automotive, industrial, or consumer electronics industry, this small outline package delivers exceptional value and benefits. Say goodbye to signal interference and hello to seamless communication. Upgrade your technology with the UCC561DP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation on a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage levels, providing flexibility in a variety of electronic applications.

Minimum Supply Voltage: 2.7 V

Allows for operation at lower voltage levels, making it suitable for a wide range of devices.

Maximum Operating Temperature: 70 °C

Can operate efficiently at high temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures, making it suitable for applications that require a wide temperature range.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides good conductivity, corrosion resistance, and enhances the overall durability of the product.

No. of Signal Lines: 27

Having 27 signal lines allows for the termination and support of multiple data bus lines, making it versatile for different system architectures.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage level commonly used in many electronic devices, ensuring compatibility with various systems.

Technical Specifications

Data Bus Terminators UCC561DP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Nominal Pull Up Resistance:

237 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

UCC561DP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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