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UCC561DPTRG4

Texas Instruments

UCC561DPTRG4 by Texas Instruments

UCC561DPTRG4 by Texas Instruments is a data bus terminator with 16 terminals and a package style of small outline. It operates b/w 0 to 70 °C, with a supply voltage range of 2.7V to 5.25V, making it suitable for commercial applications requiring bus terminator support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,486 parts In-Stock

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Digiode

USA . 3,762 parts In-Stock

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3,762

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Distributors (Availability)

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AZTECH Wire

Italy . 871 parts In-Stock

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$9.437

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871

$9.437

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Parana Technologies

USA . 882 parts In-Stock

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$9.573

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$10.169

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882

$9.573

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$10.169

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DigiPath Technology Company

USA . 1,221 parts In-Stock

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$10.541

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$9.698

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$10.541

$9.698

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IDEA Electronic Components Group

UK . 1,325 parts In-Stock

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$10.756

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$10.218

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$9.680

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1,325

$10.756

$10.218

$9.680

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ChromeModa Solutions

Germany . 1,305 parts In-Stock

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$10.756

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$8.820

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$10.756

$8.820

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One Stop Electronics

USA . 1,139 parts In-Stock

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$42.500

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Corphita

USA . 3,788 parts In-Stock

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Perfect Parts

USA . 2,145 parts In-Stock

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Microchip USA

USA . 294 parts In-Stock

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Overview

Upgrade your data bus system with the UCC561DPTRG4 by Texas Instruments. Designed with precision and reliability in mind, this high-quality data bus terminator offers unparalleled performance and durability. Perfect for a wide range of applications, this product ensures seamless communication and optimal signal integrity. Trust in Texas Instruments to provide top-notch solutions for your electronic needs. Experience the value and benefits this product brings to your projects today.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

This material provides durability and protection for the internal components of the data bus terminator, ensuring a long lifespan.

Maximum Supply Voltage : 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of systems and configurations.

Minimum Operating Temperature : 0 °C

The wide operating temperature range ensures that the data bus terminator can function in various environmental conditions.

Terminal Finish : NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, enhancing the overall performance of the data bus terminator.

Nominal Pull Up Resistance : 237 ohm

The low pull up resistance ensures efficient signal transmission and minimal signal degradation in the data bus system.

Interface IC Type : BUS TERMINATOR SUPPORT CIRCUIT

This feature indicates that the data bus terminator is specifically designed to support bus termination circuits, ensuring optimal signal integrity.

Technical Specifications

Data Bus Terminators UCC561DPTRG4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

27

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Nominal Pull Up Resistance:

237 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

UCC561DPTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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