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SN74ACT1071DE4

Texas Instruments

SN74ACT1071DE4 by Texas Instruments

SN74ACT1071DE4 by Texas Instruments is a CMOS technology Data Bus Terminator with 10 signal lines. It operates b/w -40 to 85 °C and has a supply voltage range of 4.5V to 5.5V, drawing a max current of 0.04 mA. Ideal for industrial applications requiring diode bus termination arrays in compact SMD packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,696 parts In-Stock

1+ parts

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5,696

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Digiode

USA . 3,521 parts In-Stock

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3,521

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,376 parts In-Stock

1+ parts

$6.856

100+ parts

-

1k+ parts

$7.482

10k+ parts

-

1,376

$6.856

-

$7.482

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ChromeModa Solutions

Germany . 4,562 parts In-Stock

1+ parts

$7.703

100+ parts

$6.316

1k+ parts

-

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4,562

$7.703

$6.316

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IDEA Electronic Components Group

UK . 823 parts In-Stock

1+ parts

$7.703

100+ parts

-

1k+ parts

$6.933

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823

$7.703

-

$6.933

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AZTECH Wire

Italy . 589 parts In-Stock

1+ parts

$8.661

100+ parts

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589

$8.661

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One Stop Electronics

USA . 506 parts In-Stock

1+ parts

$37.500

100+ parts

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506

$37.500

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Corphita

USA . 2,221 parts In-Stock

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2,221

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DigiPath Technology Company

USA . 172 parts In-Stock

1+ parts

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100+ parts

$6.945

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172

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$6.945

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the SN74ACT1071DE4 Data Bus Terminator. This cutting-edge technology is designed to enhance the performance and efficiency of your electronic systems, offering seamless integration and superior functionality. Ideal for a wide range of applications, this product provides unmatched value and benefits to customers looking for top-of-the-line components. Trust Texas Instruments for all your semiconductor needs and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable, the product offers easy installation and space-saving benefits in electronic circuit designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product can handle a wide range of voltage inputs, adding flexibility to the system design.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement allows the product to operate efficiently even with lower power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable operation in various environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The product can function effectively in extreme cold temperatures, making it suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high-speed operation, making it an energy-efficient solution.

Technical Specifications

Data Bus Terminators SN74ACT1071DE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

10

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Terminators

Maximum Supply Current:

.04 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74ACT1071DE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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