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SN74F1016DWE4

Texas Instruments

SN74F1016DWE4 by Texas Instruments

SN74F1016DWE4 by Texas Instruments is a 20-terminal data bus terminator with 16 signal lines. It operates at temperatures from 0 to 70°C, with a nominal voltage of 5V. This small outline package is ideal for diode bus termination arrays in commercial-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,396 parts In-Stock

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6,396

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Digiode

USA . 4,740 parts In-Stock

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4,740

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,254 parts In-Stock

1+ parts

$2.113

100+ parts

-

1k+ parts

$2.628

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1,254

$2.113

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$2.628

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IDEA Electronic Components Group

UK . 2,162 parts In-Stock

1+ parts

$2.374

100+ parts

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$2.137

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2,162

$2.374

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$2.137

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ChromeModa Solutions

Germany . 304 parts In-Stock

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$2.374

100+ parts

$1.947

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304

$2.374

$1.947

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AZTECH Wire

Italy . 606 parts In-Stock

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$19.718

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606

$19.718

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One Stop Electronics

USA . 551 parts In-Stock

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$44.500

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551

$44.500

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DigiPath Technology Company

USA . 1,897 parts In-Stock

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$2.140

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1,897

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$2.140

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Corphita

USA . 396 parts In-Stock

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Overview

Enhance the efficiency of your data bus systems with the SN74F1016DWE4 by Texas Instruments. Crafted with precision and quality, this data bus terminator offers reliable performance and seamless integration into a wide range of applications. Whether you're in the automotive industry or designing cutting-edge electronics, trust in Texas Instruments to deliver innovation and excellence. Experience the value and benefits of this product firsthand, and unlock new possibilities for your projects. Elevate your systems with the SN74F1016DWE4 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and resistance to heat, making this product suitable for various operating conditions.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 20

With 20 terminals, this product can accommodate a large number of connections, making it versatile for different applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in environments with elevated temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the longevity of the product.

Width: 7.5 mm

The compact width of 7.5 mm allows for space-efficient integration into circuit designs, ideal for applications where size constraints are a concern.

Nominal Pull Up Resistance: 50 ohm

The 50 ohm pull up resistance helps to maintain signal integrity and prevent signal reflections, ensuring smooth and reliable data transmission.

No. of Signal Lines: 16

With 16 signal lines, this product can support a wide range of data transmission requirements, making it suitable for complex communication systems.

Technical Specifications

Data Bus Terminators SN74F1016DWE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Nominal Pull Up Resistance:

50 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74F1016DWE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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