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SN74ACT1073DWE4

Texas Instruments

SN74ACT1073DWE4 by Texas Instruments

SN74ACT1073DWE4 by Texas Instruments is a Data Bus Terminator with 16 signal lines, operating at 5V. It features CMOS technology, GULL WING terminals, and a peak reflow temperature of 260°C. Ideal for industrial applications requiring diode bus termination arrays in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,265 parts In-Stock

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8,265

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Digiode

USA . 3,286 parts In-Stock

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3,286

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 263 parts In-Stock

1+ parts

$7.370

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263

$7.370

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Parana Technologies

USA . 1,106 parts In-Stock

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$7.718

100+ parts

-

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$8.250

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1,106

$7.718

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$8.250

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DigiPath Technology Company

USA . 1,194 parts In-Stock

1+ parts

$8.499

100+ parts

$7.819

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1,194

$8.499

$7.819

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ChromeModa Solutions

Germany . 2,289 parts In-Stock

1+ parts

$8.672

100+ parts

$7.111

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2,289

$8.672

$7.111

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IDEA Electronic Components Group

UK . 1,276 parts In-Stock

1+ parts

$8.672

100+ parts

$8.238

1k+ parts

$7.805

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1,276

$8.672

$8.238

$7.805

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One Stop Electronics

USA . 1,285 parts In-Stock

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$41.500

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1,285

$41.500

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Corphita

USA . 1,659 parts In-Stock

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1,659

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Overview

Enhance your data bus systems with the SN74ACT1073DWE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This data bus terminator offers exceptional value and benefits, ensuring optimal performance in various applications. Say goodbye to signal line issues and hello to seamless communication with this high-quality product. Trust Texas Instruments to provide you with the solutions you need for your electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltage levels for versatile use.

Minimum Supply Voltage: 4.5 V

Wide range of supply voltage acceptance for flexibility in different applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides corrosion resistance and high conductivity for optimal performance.

No. of Signal Lines: 16

Multiple signal lines for efficient data transmission and communication.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with a wide range of systems.

Technical Specifications

Data Bus Terminators SN74ACT1073DWE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74ACT1073DWE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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