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SN74ACT1073DWRE4

Texas Instruments

SN74ACT1073DWRE4 by Texas Instruments

SN74ACT1073DWRE4 by Texas Instruments is a CMOS technology IC with 16 signal lines, operating at 5V. It features dual terminal position, nickel palladium gold finish, and peak reflow temperature of 260°C. Ideal for data bus termination applications in industrial settings due to its small outline package and wide temperature range from -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,916 parts In-Stock

1+ parts

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2,916

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Digiode

USA . 55 parts In-Stock

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55

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,196 parts In-Stock

1+ parts

$10.113

100+ parts

-

1k+ parts

$10.659

10k+ parts

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1,196

$10.113

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$10.659

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DigiPath Technology Company

USA . 200 parts In-Stock

1+ parts

$11.136

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200

$11.136

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ChromeModa Solutions

Germany . 6,153 parts In-Stock

1+ parts

$11.363

100+ parts

$9.318

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6,153

$11.363

$9.318

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IDEA Electronic Components Group

UK . 2,128 parts In-Stock

1+ parts

$11.363

100+ parts

$10.795

1k+ parts

$10.227

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2,128

$11.363

$10.795

$10.227

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AZTECH Wire

Italy . 521 parts In-Stock

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$14.743

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521

$14.743

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One Stop Electronics

USA . 1,457 parts In-Stock

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$27.500

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1,457

$27.500

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Corphita

USA . 3,899 parts In-Stock

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3,899

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Overview

Enhance the performance of your data bus systems with the SN74ACT1073DWRE4 by Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this diode bus termination array offers unmatched reliability and efficiency. Perfect for industrial applications, this product ensures seamless signal transmission and optimal system functionality. Invest in the SN74ACT1073DWRE4 today and experience the value of superior performance and exceptional quality in your data bus terminators.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Surface Mount: YES

Makes installation easier and saves space on PCB.

Maximum Supply Voltage: 5.5 V

Can accommodate a wide range of power supplies.

Minimum Supply Voltage: 4.5 V

Ensures compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature requirements.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without issues.

No. of Terminals: 20

Enough terminals for connecting multiple signal lines.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance.

Width: 7.5 mm

Compact size for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Terminal Form: GULL WING

Allows for easy soldering and secure connections.

Technical Specifications

Data Bus Terminators SN74ACT1073DWRE4 attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

16

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74ACT1073DWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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