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MC34268DT

Onsemi

MC34268DT by Onsemi

MC34268DT by Onsemi is a small outline data bus terminator with 2 terminals. It operates b/w 0-125 °C, supporting a nominal voltage of 4.25V. Ideal for applications requiring bus terminator support circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 6,750 parts In-Stock

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Vyrian

USA . 2,072 parts In-Stock

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Digiode

USA . 1,522 parts In-Stock

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Resion

USA . 1,520 parts In-Stock

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ECAB

Sweden . 759 parts In-Stock

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759

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Electronics Depot

USA . 291 parts In-Stock

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R&J Components

USA . 263 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 167 parts In-Stock

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A&K Electronics

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Bristol Electronics

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Inland Empire Components Inc.

USA . 128 parts In-Stock

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Rotakorn

Sweden . 87 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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TANS Electronics

Latvia . 5,549 parts In-Stock

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Problanco Electronics

Mexico . 4,711 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,025 parts In-Stock

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Kulean Microsystems

USA . 1,792 parts In-Stock

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Infinite Electronics LLP (Excess)

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Corphita

USA . 937 parts In-Stock

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Corohmni

South Africa . 435 parts In-Stock

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SupplyDigital Components

Austria . 433 parts In-Stock

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Perfect Parts

USA . 374 parts In-Stock

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Microchip USA

USA . 370 parts In-Stock

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UHIMA Technologies

Türkiye . 289 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 167 parts In-Stock

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Glotronic Ltd.

UK . 134 parts In-Stock

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Assy Fe

Spain . 22 parts In-Stock

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Overview

Enhance your data bus system with the MC34268DT by Onsemi! Designed with precision and reliability, this small outline package offers top-notch performance in terminating bus systems. Whether it's for automotive, industrial or consumer electronics applications, this product ensures optimal signal integrity and data transmission. Trust Onsemi's expertise in semiconductor manufacturing to deliver a high-quality solution that guarantees seamless connectivity and efficient operation. Upgrade your data bus network today with the MC34268DT and experience the difference in performance and reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides lightweight and durable construction for easy handling and long-lasting use.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Maximum Operating Temperature: 125 °C

Ensures reliable performance in various operating environments without risk of overheating.

Maximum Seated Height: 2.38 mm

Low-profile design enables compact PCB layout and reduces interference with nearby components.

Nominal Supply Voltage: 4.25 V

Optimized voltage level for efficient operation and compatibility with standard power sources.

Technical Specifications

Data Bus Terminators MC34268DT attributes and parameters. Explore more Data Bus Terminators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Length:

6.54 mm

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Nominal Supply Voltage:

4.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Width:

6.16 mm

Trade Compliance

MC34268DT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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