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MCCS142235DW

Onsemi

MCCS142235DW by Onsemi

MCCS142235DW by Onsemi is a SCSI bus terminator with 18 signal lines, 110 ohm pull-up resistance, and 2.85V nominal voltage. It is used in data communication systems for terminating bus signals efficiently at a max operating temperature of 70 °C. The small outline package style with gull wing terminals makes it suitable for surface mount applications.

Median Price

$3.145

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 95 parts In-Stock

1+ parts

-

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$2.720

1k+ parts

$2.430

10k+ parts

$2.290

95

-

$2.720

$2.430

$2.290

DigiKey

USA . 95 parts In-Stock

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$3.570

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95

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$3.570

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Digiode

USA . 835 parts In-Stock

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$2.878

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835

$2.878

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American Microsemiconductor Inc.

USA . 4 parts In-Stock

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$5.020

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$5.020

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Vyrian

USA . 5,522 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 500 parts In-Stock

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PC Components Company LLC

USA . 155 parts In-Stock

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Bristol Electronics

USA . 130 parts In-Stock

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Cyclops Electronics Ltd

UK . 100 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,539 parts In-Stock

1+ parts

$2.727

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1,539

$2.727

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Corohmni

South Africa . 328 parts In-Stock

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$3.030

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QUARKTWIN TECHNOLOGY LTD

USA . 22,821 parts In-Stock

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Problanco Electronics

Mexico . 7,757 parts In-Stock

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SupplyDigital Components

Austria . 7,518 parts In-Stock

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TANS Electronics

Latvia . 4,712 parts In-Stock

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Kulean Microsystems

USA . 2,973 parts In-Stock

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UHIMA Technologies

Türkiye . 468 parts In-Stock

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Metaverse IC Inc.

Canada . 200 parts In-Stock

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Overview

Unlock seamless data transfer with the MCCS142235DW by Onsemi, a top-of-the-line Data Bus Terminator designed to optimize performance and reliability. Crafted with precision using high-quality materials, this product offers unmatched value and benefits to customers seeking superior connectivity solutions. From commercial to industrial applications, this compact and versatile device ensures smooth operations even in challenging environments. Trust Onsemi's reputation for excellence and elevate your system's efficiency with the MCCS142235DW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and insulation, making the product suitable for a wide range of environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 2.95 V

Can operate at relatively high voltages, providing flexibility in power supply options.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board, optimizing design layout.

No. of Terminals: 24

Provides ample connection points for various signals, ensuring compatibility with a range of devices.

Minimum Operating Temperature: 0 °C

Can withstand low temperatures, making it suitable for use in environments where temperature fluctuations occur.

Terminal Finish: TIN LEAD

The tin lead finish enhances the conductivity of terminals, ensuring reliable signal transmission.

Width: 7.5 mm

Compact width allows for efficient use of space on the circuit board, ideal for designs with size constraints.

No. of Signal Lines: 18

Provides multiple signal lines for effective data transmission, supporting complex communication protocols.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and reliable performance in SCSI systems.

Technical Specifications

Data Bus Terminators MCCS142235DW attributes and parameters. Explore more Data Bus Terminators devices from Onsemi

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.4 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.9

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

2.95 V

Minimum Supply Voltage:

2.75 V

Nominal Supply Voltage:

2.85 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MCCS142235DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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