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MCCS142235FAR2

Onsemi

MCCS142235FAR2 by Onsemi

The Onsemi MCCS142235FAR2 is a Data Bus Terminator with 32 terminals, operating at 0-70 °C. It features a supply voltage range of 2.75-2.95V and pull-up resistance of 110Ω. Ideal for SCSI interfaces, this low-profile flatpack is surface-mountable and has a quad-terminal position.

Median Price

$13.140

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

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$13.140

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750

$13.140

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Digiode

USA . 2,052 parts In-Stock

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Vyrian

USA . 1,145 parts In-Stock

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1,145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,616 parts In-Stock

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Kulean Microsystems

USA . 6,998 parts In-Stock

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6,998

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Problanco Electronics

Mexico . 6,474 parts In-Stock

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6,474

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TANS Electronics

Latvia . 4,713 parts In-Stock

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4,713

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Corphita

USA . 1,831 parts In-Stock

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1,831

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UHIMA Technologies

Türkiye . 754 parts In-Stock

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754

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Corohmni

South Africa . 169 parts In-Stock

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Overview

Upgrade your data bus system with the MCCS142235FAR2 by Onsemi, a top-quality data bus terminator that offers reliable performance and seamless integration. With Onsemi's reputation for excellence in manufacturing, you can trust that this product is built to last. Ideal for a wide range of applications, this terminator provides unmatched value and benefits to customers looking for a dependable solution. Say goodbye to connectivity issues and hello to smooth operations with the MCCS142235FAR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the data bus terminator, making it reliable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 2.95 V

With a high maximum supply voltage, this data bus terminator can handle a wide range of power inputs, ensuring compatibility with different systems.

Minimum Supply Voltage: 2.75 V

The low minimum supply voltage ensures efficient power consumption and operation of the data bus terminator, making it energy-efficient.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance enables the data bus terminator to function reliably even in environments with elevated temperatures.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and conductivity, ensuring secure connections and efficient signal transmission.

Terminal Position: QUAD

The quad terminal position design allows for stable and secure placement on the circuit board, enhancing the overall stability and performance of the data bus terminator.

No. of Signal Lines: 18

With 18 signal lines, this data bus terminator can support a high volume of data transmission, making it suitable for complex networking and communication systems.

Technical Specifications

Data Bus Terminators MCCS142235FAR2 attributes and parameters. Explore more Data Bus Terminators devices from Onsemi

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

2.9

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

2.95 V

Minimum Supply Voltage:

2.75 V

Nominal Supply Voltage:

2.85 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

MCCS142235FAR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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