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MCCS142236DW

Onsemi

MCCS142236DW by Onsemi

The Onsemi MCCS142236DW is a SCSI bus terminator with 18 signal lines and 110 ohm pull-up resistance. It operates b/w 0-70 °C, with supply voltage ranging from 3.8-5.25V. This small outline package is ideal for data bus termination applications in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 1,374 parts In-Stock

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Vyrian

USA . 1,130 parts In-Stock

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NexGen Digital

USA . 60 parts In-Stock

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TANS Electronics

Latvia . 7,851 parts In-Stock

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SupplyDigital Components

Austria . 4,451 parts In-Stock

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Problanco Electronics

Mexico . 3,386 parts In-Stock

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Kulean Microsystems

USA . 3,014 parts In-Stock

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Corphita

USA . 2,156 parts In-Stock

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Corohmni

South Africa . 349 parts In-Stock

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UHIMA Technologies

Türkiye . 249 parts In-Stock

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Overview

Enhance your data bus system with the MCCS142236DW by Onsemi, a top-quality SCSI bus terminator designed for optimal performance and reliability. Onsemi, a trusted manufacturer known for their cutting-edge technology, delivers innovative solutions for various applications in the electronics industry. This sleek rectangular package features a small outline design, making it easy to integrate into your system. With a nominal pull-up resistance of 110 ohm and dual terminal position, this terminator ensures seamless data transmission at a maximum supply voltage of 5.25 V. Upgrade your setup today with the MCCS142236DW and experience superior connectivity and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on printed circuit boards.

Maximum Supply Voltage: 5.25 V

Support for a high maximum supply voltage ensures compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into designs.

Power Supplies (V): 3.8/5.25

Support for multiple power supply voltages provides flexibility in system design.

No. of Terminals: 28

A higher number of terminals allow for more connections and functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is ideal for compact designs.

Minimum Supply Voltage: 3.8 V

Low minimum supply voltage allows for operation in power-constrained environments.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in cold environments.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and reliability for long-term use.

Terminal Position: DUAL

Dual terminal position allows for secure connections and better signal transmission.

Maximum Seated Height: 2.65 mm

Low maximum seated height saves space and is suitable for compact designs.

Width: 7.5 mm

Narrow width allows for efficient use of space on the PCB.

Length: 17.925 mm

Optimal length for easy integration and compatibility with standard PCB sizes.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard operating conditions.

Nominal Pull Up Resistance: 110 ohm

The nominal pull up resistance value helps in maintaining signal integrity in the data bus.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and secure connections.

No. of Signal Lines: 18

A higher number of signal lines allow for more data transmission and communication capabilities.

Nominal Supply Voltage: 4.75 V

Stable nominal supply voltage ensures consistent performance of the data bus terminator.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact design and efficient use of PCB space.

Interface IC Type: SCSI BUS TERMINATOR

Specific interface IC type ensures compatibility with SCSI bus systems and devices.

Technical Specifications

Data Bus Terminators MCCS142236DW attributes and parameters. Explore more Data Bus Terminators devices from Onsemi

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

17.925 mm

No. of Functions:

1

No. of Signal Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.8/5.25

Nominal Pull Up Resistance:

110 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MCCS142236DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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