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UCC5630AMWP

Texas Instruments

UCC5630AMWP by Texas Instruments

UCC5630AMWP by Texas Instruments is a SCSI bus terminator with 36 terminals and BICMOS technology. It operates b/w 0-70°C, with supply voltage ranging from 2.7V to 5.25V. This small outline package is ideal for data bus termination applications.

Median Price

$2.900

Lifecycle Status

Suppliers In-Stock

33

In-Stock Inventory

1k+

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Chip1Stop

Japan . 64 parts In-Stock

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$4.760

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DigiKey

USA . 8,229 parts In-Stock

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$2.950

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Rochester

USA . 8,228 parts In-Stock

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$2.550

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$2.280

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$2.140

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Verical

USA . 6,175 parts In-Stock

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$2.850

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Greenchips

USA . 125 parts In-Stock

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$2.357

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$2.244

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$1.929

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Digiode

USA . 1,467 parts In-Stock

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Vyrian

USA . 703 parts In-Stock

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DigiKey Marketplace

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ComSIT Distribution GmbH

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Speed Components Ltd

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Electronics Depot

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A2Z Electronics, Inc.

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Sunrise Surplus Inc.

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Electronic Expediters

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Bristol Electronics

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Sea View Technologies

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Cyclops Electronics Ltd

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Microfarads

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J & M Industries LLC

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R&J Components

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Mil-Aero Solutions, Inc.

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Lakeland Logistics Inc

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SIE Connect GmbH - GreenChips

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Pegasus Components GmbH

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Prism Electronics

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Inventory MP

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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Atlantic Semiconductor

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Digital Electronic Gebert Verwaltungs UG

Germany . 24 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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EPE Components Inc.

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EMSNET

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Corphita

USA . 1,501 parts In-Stock

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$2.556

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Parana Technologies

USA . 1,478 parts In-Stock

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$4.556

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$5.005

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ChromeModa Solutions

Germany . 3,350 parts In-Stock

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$5.119

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$4.198

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IDEA Electronic Components Group

UK . 1,307 parts In-Stock

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$4.607

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Metaverse IC Inc.

Canada . 15,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Kepictronics

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DigiPath Technology Company

USA . 1,281 parts In-Stock

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Perfect Parts

USA . 143 parts In-Stock

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Overview

Unlock the potential of your data bus with the Texas Instruments UCC5630AMWP. Manufactured with top-notch quality and reliability, this SCSI bus terminator is a game-changer in the industry. From ensuring smooth data transmission to enhancing system performance, this product offers unparalleled value and benefits to customers. Whether you're working on communications, networking, or industrial applications, the UCC5630AMWP is the ultimate solution for all your termination needs. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the data bus terminator.

Surface Mount: YES

Surface mount capability allows for easy and secure installation onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Allows for a wide range of compatibility with various power supplies and ensures stable performance within the specified voltage range.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, offering flexibility in system integration.

No. of Terminals: 36

Provides ample connectivity options for interfacing with other components in the system.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance even in demanding environmental conditions.

Nominal Pull Up Resistance: 105 ohm

The specified pull-up resistance helps in maintaining signal integrity and reducing interference in the data bus communication.

Interface IC Type: SCSI BUS TERMINATOR

Specifically designed for SCSI bus termination, ensuring compatibility and optimal performance in SCSI-based systems.

Technical Specifications

Data Bus Terminators UCC5630AMWP attributes and parameters. Explore more Data Bus Terminators devices from Texas Instruments

Specs

Differential Output:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e4

Length:

15.385 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Signal Lines:

9

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Nominal Pull Up Resistance:

105 ohm

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Sub-Category:

Bus Terminators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

UCC5630AMWP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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